Journal of Electronic Materials

, Volume 42, Issue 10, pp 2897–2904 | Cite as

Simultaneous Formation of Ohmic Contacts on p +- and n +-4H-SiC Using a Ti/Ni Bilayer

  • Sung-Jae Joo
  • Sangwon Baek
  • Sang-Cheol Kim
  • Jeong-Soo Lee


In this work, Ti/Ni bilayer contacts were fabricated on both p +- and n +-4H-SiC formed by ion implantation, and the effects of the Ti interlayer on the contact resistance and interfacial microstructure were studied. Adoption of a thin (10 nm) Ti interlayer resulted in specific contact resistance of 4.8 μΩ cm2 and 1.3 mΩ cm2 on n +- and p +-4H-SiC, respectively, comparable to the values for contacts using only Ni. Moreover, contacts using Ti/Ni provide a flat and uniform interface between Ni2Si and SiC, whereas discontinuous, agglomerated Ni2Si islands are formed without the use of a Ti interlayer. In addition, the Ti interlayer was demonstrated to effectively dissociate the thin oxide film on SiC, which is advantageous for low-resistance, reliable ohmic contact formation. In summary, use of a Ti/Ni bilayer is a promising solution for one-step formation of ohmic contacts on both p +- and n +-4H-SiC, being especially suitable for SiC n-channel metal-oxide-semiconductor field-effect transistor (nMOSFET) fabrication.


4H-SiC ohmic contact Ti Ni 


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Copyright information

© TMS 2013

Authors and Affiliations

  • Sung-Jae Joo
    • 1
  • Sangwon Baek
    • 2
  • Sang-Cheol Kim
    • 3
  • Jeong-Soo Lee
    • 2
  1. 1.Creative and Fundamental Research DivisionKorea Electrotechnology Research InstituteChangwonKorea
  2. 2.Department of Electrical & Electronic EngineeringPOSTECHPohangKorea
  3. 3.HVDC Research DivisionKorea Electrotechnology Research InstituteChangwonKorea

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