Journal of Electronic Materials

, Volume 42, Issue 9, pp 2752–2757 | Cite as

Thermoelectric Power Generation Characteristics of a Thin-Film Device Consisting of Electrodeposited n-Bi2Te3 and p-Sb2Te3 Thin-Film Legs

Article

Abstract

A thermoelectric thin-film device of the cross-plane configuration was fabricated by flip-chip bonding of the top electrodes to 242 pairs of electrodeposited n-type Bi2Te3 and p-type Sb2Te3 thin-film legs on the bottom substrate. The electrodeposited Bi2Te3 and Sb2Te3 films of 20-μm thickness exhibited Seebeck coefficients of −59 μV/K and 485 μV/K, respectively. The internal resistance of the thin-film device was measured as 3.7 kΩ, most of which was attributed to the interfacial resistance of the flip-chip joints. The actual temperature difference ΔT G working across the thin-film legs was estimated to be 10.4 times smaller than the apparent temperature difference ΔT applied across the thin-film device. The thin-film device exhibited an open-circuit voltage of 0.294 V and a maximum output power of 5.9 μW at an apparent temperature difference ΔT of 22.3 K applied across the thin-film device.

Keywords

Thermoelectric device thin film Bi2Te3 Sb2Te3 electrodeposition flip chip 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    J.P. Carmo, J.F. Ribeiro, M.F. Goncalves, and J.H. Correia, J. Micromech. Microeng. 20, 1 (2010).CrossRefGoogle Scholar
  2. 2.
    W. Glatz, E. Schwyter, L. Durrer, and C. Hierold, J. Microelectromech. Syst. 18, 763 (2009).CrossRefGoogle Scholar
  3. 3.
    Z. Wang, B. Leonov, P. Fiorini, and C.V. Hoof, Sens. Actuators A 156, 95 (2009).CrossRefGoogle Scholar
  4. 4.
    J. Xie, C. Lee, and H. Feng, J. Microelectromech. Syst. 19, 317 (2010).CrossRefGoogle Scholar
  5. 5.
    M. Takashiri, T. Shirakawa, K. Miyazaki, and H. Tsukamoto, Sens. Actuators A 138, 329 (2007).CrossRefGoogle Scholar
  6. 6.
    G.J. Snyder, J.R. Lim, C.-K. Huang, and J.-P. Fleurial, Nat. Mater. 2, 528 (2003).CrossRefGoogle Scholar
  7. 7.
    H. Bottner, J. Nurnus, A. Gavrikov, G. Kuhner, M. Jagle, C. Kunzel, D. Eberhard, G. Plescher, A. Schubert, and K.-H. Schlereth, J. Microelectromech. Syst. 13, 414 (2004).CrossRefGoogle Scholar
  8. 8.
    T.S. Oh, K.Y. Lee, Y.H. Lee, and B.Y. Jung, Met. Mater. Int. 15, 479 (2009).CrossRefGoogle Scholar
  9. 9.
    T.S. Oh, K.Y. Lee, and H.Y. Won, IEEE Trans. Comp. Packag. Technol. 32, 909 (2009).CrossRefGoogle Scholar
  10. 10.
    M.Y. Kim and T.S. Oh, Thin Solid Films 518, 6550 (2010).CrossRefGoogle Scholar
  11. 11.
    S.K. Lim, M.Y. Kim, and T.S. Oh, Thin Solid Films 517, 4199 (2009).CrossRefGoogle Scholar
  12. 12.
    M.Y. Kim and T.S. Oh, Mater. Trans. 53, 2160 (2012).CrossRefGoogle Scholar
  13. 13.
    M.S. Gonzalez, A.L. Prieto, R. Gronsky, T. Sands, and A.M. Stacy, J. Electrochem. Soc. 149, C546 (2002).CrossRefGoogle Scholar
  14. 14.
    K. Tittes, A. Bund, W. Plieth, A. Bentien, S. Paschen, M. Plotner, H. Grafe, and W.-J. Fischer, J. Solid State Electrochem. 7, 714 (2003).CrossRefGoogle Scholar
  15. 15.
    S. Michel, S. Diliberto, C. Boulanger, and B. Bolle, J. Cryst. Growth 296, 227 (2006).CrossRefGoogle Scholar
  16. 16.
    T.S. Oh, D.B. Hyun, and N.V. Kolomoets, Scripta Mater. 42, 849 (2000).CrossRefGoogle Scholar
  17. 17.
    W.M. Yim and F.D. Rosi, J. Solid State Electron. 15, 1121 (1972).CrossRefGoogle Scholar
  18. 18.
    Y. Kim, A. DiVenere, G.K.L. Wong, J.B. Ketterson, S. Cho, and J.R. Meyer, J. Appl. Phys. 91, 715 (2002).CrossRefGoogle Scholar
  19. 19.
    L.M. Goncalves, P. Alpuim, A.G. Rolo, and J.H. Correia, Thin Solid Films 519, 4152 (2011).CrossRefGoogle Scholar
  20. 20.
    S.A. Baily and D. Emin, Phys. Rev. B 73, 165211 (2006).CrossRefGoogle Scholar
  21. 21.
    V.D. Das, N. Soundararajan, and M. Pattabi, J. Mater. Sci. 22, 3522 (1987).CrossRefGoogle Scholar
  22. 22.
    Y.A. Cengel, Introduction to Thermodynamics and Heat Transfer, Vol. II (Boston: McGraw-Hill, 2001), p. A-25.Google Scholar
  23. 23.
    K. Miyazaki, M. Takashiri, J. Kurosaki, B. Lenoir, A. Dauscher, and H. Tsukamoto, 26th Int. Conf. on Thermoelectrics (2007), p. 294.Google Scholar
  24. 24.
    G.-H. Dong, Y.-J. Zhu, and L.-D. Chen, J. Mater. Chem. 20, 1976 (2010).CrossRefGoogle Scholar
  25. 25.
    D.M. Rowe, Thermoelectrics Handbook: Macro to Nano (New York: CRC Press, 2006), p. 16.Google Scholar

Copyright information

© TMS 2013

Authors and Affiliations

  1. 1.Department of Materials Science and EngineeringHongik UniversitySeoulKorea

Personalised recommendations