The Stressing Effect of Electromigration from the Maxwell Stress and a Preliminary Mean-Time-to-Failure Analysis
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Abstract
As temperature increases, it is suggested that atoms on lattice sites serve as dynamic defects and cause a much more homogeneous distribution of the Maxwell stress throughout the crystal lattice compared with that caused by static defects. Though this stressing effect mostly leads to Joule heating, it also results in distortion of the crystal lattice, which leads to a decrease in the activation energy for atomic diffusion and causes enhancements in the phase growth rates at both interfaces of diffusion couples. Due to this stressing effect, the decrease in the activation energy is proportional to a square term of the current density J. A mean-time-to-failure analysis is performed for failure caused by excessive growth of intermediate phases, and a mean-time-to-failure (MTTF) equation is found. This equation appears similar to Black’s equation but with an extra exponential term arising from the stressing effect of the crystal lattice.
Keywords
Electromigration stressing effect Black’s equationPreview
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References
- 1.H.B. Huntington, Diffusion in Solids: Recent Developments, ed. A.S. Nowick, J.J. Burton (Academic, New York, 1975).Google Scholar
- 2.P. Zhou and W.C. Johnson, J. Electron. Mater. 39, 2583 (2010).CrossRefGoogle Scholar
- 3.W.C. Liu, S.W. Chen, and C.M. Chen, J. Electron. Mater. 27, L5 (1998).CrossRefGoogle Scholar
- 4.N. Bertolino, J. Garay, U. Anselmi-Tamburini, and Z.A. Munir, Scr. Mater. 44, 737 (2001).CrossRefGoogle Scholar
- 5.J.E. Garay, U. Anselmi-Tamburini, and Z.A. Munir, Acta Mater. 51, 4487 (2003).CrossRefGoogle Scholar
- 6.J.R. Friedman, J.E. Garay, U. Anselmi-Tamburini, and Z.A. Munir, Intermetallics 12, 589 (2004).CrossRefGoogle Scholar
- 7.R. Chen and F. Yang, J. Phys. D: Appl. Phys. 41, 065404 (2008).Google Scholar
- 8.R. Chen and F. Yang, J. Electron. Mater. 39, 2611 (2010).CrossRefGoogle Scholar
- 9.J.R. Black, Proc. IEEE 57, 1587 (1969).CrossRefGoogle Scholar
- 10.J.R. Lloyd, Microelectron. Reliab. 47, 1468 (2007).CrossRefGoogle Scholar
- 11.de R.L. Orio, H. Ceric, and S. Selberherr, Microelectron. Reliab. 50, 775 (2010).CrossRefGoogle Scholar
- 12.K. Charles, Introduction to Solid State Physics (New York: Wiley, 1986).Google Scholar
- 13.M.E. Glicksman, Diffusion in Solids (New York: Wiley, 2000).Google Scholar
- 14.P. Asoka Kumar, K. OBrien, K.G. Lynn, P.J. Simpson, and K.P. Rodbell, Appl. Phys. Lett. 68, 406 (1996).CrossRefGoogle Scholar
- 15.L.A. Girifalco and D. KuhlmannWilsdorf, J. Appl. Phys. 35, 438 (1964).CrossRefGoogle Scholar
- 16.R.W. Balluffi, S.M. Allen, and W.C. Carter, Kinetics of Materials (New York: Wiley, 2005).CrossRefGoogle Scholar
- 17.C. Chen and S. Chen, J. Appl. Phys. 90, 1208 (2001).Google Scholar
- 18.C. Chen and S. Chen, Acta Materialia 50, 2461 (2002).CrossRefGoogle Scholar
- 19.P. Zhou, W.C. Johnson, and P.H. Leo, J. Electron. Mater. 40, 1876 (2011).CrossRefGoogle Scholar
- 20.Y.C. Chan and D. Yang, Prog. Mater. Sci. 55, 428 (2010).CrossRefGoogle Scholar
- 21.K. Zeng and K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002).Google Scholar