Journal of Electronic Materials

, Volume 42, Issue 6, pp 956–962 | Cite as

The Stressing Effect of Electromigration from the Maxwell Stress and a Preliminary Mean-Time-to-Failure Analysis

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Abstract

As temperature increases, it is suggested that atoms on lattice sites serve as dynamic defects and cause a much more homogeneous distribution of the Maxwell stress throughout the crystal lattice compared with that caused by static defects. Though this stressing effect mostly leads to Joule heating, it also results in distortion of the crystal lattice, which leads to a decrease in the activation energy for atomic diffusion and causes enhancements in the phase growth rates at both interfaces of diffusion couples. Due to this stressing effect, the decrease in the activation energy is proportional to a square term of the current density J. A mean-time-to-failure analysis is performed for failure caused by excessive growth of intermediate phases, and a mean-time-to-failure (MTTF) equation is found. This equation appears similar to Black’s equation but with an extra exponential term arising from the stressing effect of the crystal lattice.

Keywords

Electromigration stressing effect Black’s equation 

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References

  1. 1.
    H.B. Huntington, Diffusion in Solids: Recent Developments, ed. A.S. Nowick, J.J. Burton (Academic, New York, 1975).Google Scholar
  2. 2.
    P. Zhou and W.C. Johnson, J. Electron. Mater. 39, 2583 (2010).CrossRefGoogle Scholar
  3. 3.
    W.C. Liu, S.W. Chen, and C.M. Chen, J. Electron. Mater. 27, L5 (1998).CrossRefGoogle Scholar
  4. 4.
    N. Bertolino, J. Garay, U. Anselmi-Tamburini, and Z.A. Munir, Scr. Mater. 44, 737 (2001).CrossRefGoogle Scholar
  5. 5.
    J.E. Garay, U. Anselmi-Tamburini, and Z.A. Munir, Acta Mater. 51, 4487 (2003).CrossRefGoogle Scholar
  6. 6.
    J.R. Friedman, J.E. Garay, U. Anselmi-Tamburini, and Z.A. Munir, Intermetallics 12, 589 (2004).CrossRefGoogle Scholar
  7. 7.
    R. Chen and F. Yang, J. Phys. D: Appl. Phys. 41, 065404 (2008).Google Scholar
  8. 8.
    R. Chen and F. Yang, J. Electron. Mater. 39, 2611 (2010).CrossRefGoogle Scholar
  9. 9.
    J.R. Black, Proc. IEEE 57, 1587 (1969).CrossRefGoogle Scholar
  10. 10.
    J.R. Lloyd, Microelectron. Reliab. 47, 1468 (2007).CrossRefGoogle Scholar
  11. 11.
    de R.L. Orio, H. Ceric, and S. Selberherr, Microelectron. Reliab. 50, 775 (2010).CrossRefGoogle Scholar
  12. 12.
    K. Charles, Introduction to Solid State Physics (New York: Wiley, 1986).Google Scholar
  13. 13.
    M.E. Glicksman, Diffusion in Solids (New York: Wiley, 2000).Google Scholar
  14. 14.
    P. Asoka Kumar, K. OBrien, K.G. Lynn, P.J. Simpson, and K.P. Rodbell, Appl. Phys. Lett. 68, 406 (1996).CrossRefGoogle Scholar
  15. 15.
    L.A. Girifalco and D. KuhlmannWilsdorf, J. Appl. Phys. 35, 438 (1964).CrossRefGoogle Scholar
  16. 16.
    R.W. Balluffi, S.M. Allen, and W.C. Carter, Kinetics of Materials (New York: Wiley, 2005).CrossRefGoogle Scholar
  17. 17.
    C. Chen and S. Chen, J. Appl. Phys. 90, 1208 (2001).Google Scholar
  18. 18.
    C. Chen and S. Chen, Acta Materialia 50, 2461 (2002).CrossRefGoogle Scholar
  19. 19.
    P. Zhou, W.C. Johnson, and P.H. Leo, J. Electron. Mater. 40, 1876 (2011).CrossRefGoogle Scholar
  20. 20.
    Y.C. Chan and D. Yang, Prog. Mater. Sci. 55, 428 (2010).CrossRefGoogle Scholar
  21. 21.
    K. Zeng and K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002).Google Scholar

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© TMS 2013

Authors and Affiliations

  1. 1.Department of Astronautical Science and MechanicsHarbin Institute of TechnologyHarbinPeople’s Republic of China

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