Journal of Electronic Materials

, Volume 42, Issue 7, pp 1529–1534 | Cite as

Texturing of (Bi0.2Sb0.8)2Te3 Nanopowders by Open Die Pressing

  • S. Ceresara
  • C. Fanciulli
  • F. Passaretti
  • D. Vasilevskiy
Article
First Online:
Received:
Accepted:

Abstract

Open die pressing (ODP) at 370°C to 420°C has been employed as a straightforward forming process for sintering and texturing p-type (Bi0.2Sb0.8)2Te3 nanopowders. x-Ray diffraction pattern analysis showed that ODP samples were strongly textured, with the basal (00l) planes of the hexagonal crystal cell oriented parallel to the pressing plates. The degree of texturing, evaluated as the orientation factor, f, by the Lotgering method, increased with decreasing final thickness of the samples. It was about f = 45% for 10-mm-thick samples and reached 70% for 2-mm-thick samples. Thermoelectric properties of ODP specimens were measured by the Harman method in the range from 20°C to 170°C. The dimensionless figure of merit, ZT, for 10-mm-thick samples was around 1 from room temperature up to 100°C.

Keywords

Bi2Te3-based nanopowders texturing open die pressing thermoelectrics 
This is a preview of subscription content, log in to check access.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    B. Poudel, Q. Hao, Y. Ma, Y. Lan, A. Minnich, B. Yu, X. Yan, D. Wang, A. Muto, D. Vashaee, X. Chen, J. Liu, M.S. Dresselhaus, G. Chen, and Z. Ren, Science 320, 634–638 (2008).CrossRefGoogle Scholar
  2. 2.
    Y. Ma, G. Hao, B. Poudel, Y. Lan, D. Wang, G. Chen, and Z. Ren, Nanoletters 8, 2580–2584 (2008).CrossRefGoogle Scholar
  3. 3.
    X. Yan, B. Poudel, Y. Ma, W.S. Liu, G. Joshi, H. Wang, Y. Lan, D. Wang, G. Chen, and Z.F. Ren, Nanoletters 10, 3373–3378 (2010).CrossRefGoogle Scholar
  4. 4.
    D. Vasilevskiy, O. Bourbia, S. Gosselin, S. Tourenne, and R.A. Masut, J. Electron. Mater. 40, 1046–1051 (2011).CrossRefGoogle Scholar
  5. 5.
    S. Kalpakjian, S. Schmid, Manufacturing Processes for Engineering Materials, 5th ed. (Pearson Prentice Hall, 2007) Chap. 5.Google Scholar
  6. 6.
    P. Hidnert and H.S. Krider, J. Res. Natl. Bureau Stand. 48, 2308 (1952).Google Scholar
  7. 7.
    C. Drasar and E. Müller, Mater. Sci. Forum 492–493, 273–280 (2005).CrossRefGoogle Scholar
  8. 8.
    F.K. Lotgering and J. Inorg, Nucl. Chem. 9, 113–123 (1959).CrossRefGoogle Scholar
  9. 9.
    S. Ceresara, G. Giunchi. N. Ripamonti, Proceeding of 25 th I.C.T., Vienna, (2006) pp. 268–271.Google Scholar
  10. 10.
    S. Ceresara, F. Fanciulli, F.Passaretti, D. Vasilevskiy, Proceedings of 9 th E.C.T., Thessaloniki, (2011).Google Scholar

Copyright information

© TMS 2012

Authors and Affiliations

  • S. Ceresara
    • 1
  • C. Fanciulli
    • 1
  • F. Passaretti
    • 1
  • D. Vasilevskiy
    • 2
  1. 1.CNR-IENILeccoItaly
  2. 2.Département de Génie MécaniqueÉcole Polytechnique de MontrÉalMontréalCanada

Personalised recommendations