Journal of Electronic Materials

, Volume 41, Issue 7, pp 1907–1914 | Cite as

Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders

  • Omid Mokhtari
  • Ali Roshanghias
  • Roya Ashayer
  • Hiren R. Kotadia
  • Farzad Khomamizadeh
  • Amir H. Kokabi
  • Michael P. Clode
  • Mark Miodownik
  • Samjid H. Mannan
Open Access
Article

Abstract

The use of nanoparticles to control grain size and mechanical properties of solder alloys at high homologous temperature is explored. It is found that silica nanoparticles in the 100 nm range coated with 2 nm to 3 nm of gold can be dispersed within solders during the normal reflow soldering process, and that these particles are effective in hardening the solder and restricting dynamic grain growth during compression testing at low homologous temperature. As the homologous temperature increases towards 0.75, the effects of the nanoparticles on both mechanical properties and dynamical grain growth reduce, and by homologous temperatures of 0.86 the effects have completely disappeared. This behavior is explained by introducing the concept of an effective volume fraction of pinning nanoparticles, and the practical implications for using nanoparticles to control solder properties via Zener pinning at high homologous temperatures are discussed.

Keywords

Nanocomposite solder grain boundary hot compression 

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Copyright information

© The Author(s) 2012

Authors and Affiliations

  • Omid Mokhtari
    • 1
  • Ali Roshanghias
    • 2
  • Roya Ashayer
    • 1
  • Hiren R. Kotadia
    • 3
  • Farzad Khomamizadeh
    • 2
  • Amir H. Kokabi
    • 2
  • Michael P. Clode
    • 1
  • Mark Miodownik
    • 3
  • Samjid H. Mannan
    • 3
  1. 1.Materials Research Group, Division of EngineeringKing’s College LondonLondonUK
  2. 2.Department of Materials Science and EngineeringSharif University of TechnologyTehranIran
  3. 3.Department of PhysicsKing’s College LondonLondonUK

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