Journal of Electronic Materials

, Volume 41, Issue 6, pp 1481–1486 | Cite as

Printed Se-Doped MA n-Type Bi2Te3 Thick-Film Thermoelectric Generators

  • Deepa Madan
  • Alic Chen
  • Paul K. Wright
  • James W. Evans
Article

Abstract

In this work, we highlight new materials processing developments and fabrication techniques for dispenser-printed thick-film single-element thermoelectric generators (TEG). Printed deposition techniques allow for low-cost and scalable manufacturing of microscale energy devices. This work focuses on synthesis of unique composite thermoelectric systems optimized for low-temperature applications. We also demonstrate device fabrication techniques for high-density arrays of high-aspect-ratio planar single-element TEGs. Mechanical alloyed (MA) n-type Bi2Te3 powders were prepared by taking pure elemental Bi and Te in 36:64 molar ratio and using Se as an additive. X-ray diffraction (XRD) and scanning electron microscopy (SEM) techniques were used to characterize the as-milled powders to confirm the Bi2Te3 phase formation and particle size below 50 μm. Thermoelectric properties of the composites were measured from room temperature to 100°C. We achieved a dimensionless figure of merit (ZT) of 0.17 at 300 K for MA n-type Bi2Te3–epoxy composites with 2 wt.% Se additive. A 20 single-leg TEG prototype with 5 mm × 400 μm × 120 μm printed element dimensions was fabricated on a polyimide substrate with evaporated gold contacts. The prototype device produced a power output of 1.6 μW at 40 μA and 40 mV voltage for a temperature difference of 20°C.

Keywords

Thermoelectric energy harvesting mechanical alloy dispenser printing polymer composites 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    G.J. Snyder and E.S. Toberer, Nat. Mater. 7, 105 (2008).CrossRefGoogle Scholar
  2. 2.
    D.M. Rowe, Thermoelectrics Handbook: Micro to Nano (Boca Raton: Taylor and Francis, 2005).CrossRefGoogle Scholar
  3. 3.
    W. Glatz, E. Schwyter, L. Durrer, and C. Hierold, J. Micromech. Microeng. 18, 763 (2009).Google Scholar
  4. 4.
    J. Weber, K. Potje-Komloth, F. Haase, P. Detemple, F. Volklein, and T. Doll, Sensors Actuators A 132, 325 (2006).CrossRefGoogle Scholar
  5. 5.
    K. Gilleo, Polymer Thick Film (New York: Thomson, 2006).Google Scholar
  6. 6.
    K. Miyazaki, T. Lida, and H. Tsukamoto, Proceedings of 22nd International Conference on Thermoelectrics (France, 17–21 August, 2003), p. 641.Google Scholar
  7. 7.
    C.C. Ho, J.W. Evans, and P.K. Wright, Proceedings of Ninth Power MEMS Workshop (2009), p. 141.Google Scholar
  8. 8.
    C.C. Ho, D. Steingart, J.W. Evans, and P.K. Wright, ECS Trans. 16, 35 (2008).CrossRefGoogle Scholar
  9. 9.
    E.S. Leland, P.K. Wright, and R.M. White, J. Micromech. Microeng. 19, 094018 (2009).CrossRefGoogle Scholar
  10. 10.
    H.J. Goldsmid and R.W. Douglas, Br. J. Appl. Phys. 5, 386 (1954).CrossRefGoogle Scholar
  11. 11.
    A. Chen, M. Koplow, D. Madan, P.K. Wright, and J.W. Evans, Proc. ASME Conf. 12, 343 (2009).Google Scholar
  12. 12.
    A. Chen, D. Madan, P.K. Wright, and J.W. Evans, J. Micromech. Microeng. 21, 104006 (2011).CrossRefGoogle Scholar
  13. 13.
    L.D. Zhao, B.P. Zhang, J.F. Li, M. Zhou, and W.S. Liu, Phys. B 400, 11–15 (2007).CrossRefGoogle Scholar
  14. 14.
    D. Madan, A. Chen, P.K. Wright, and J.W. Evans, J. Appl. Phys. 109, 034904 (2011).CrossRefGoogle Scholar
  15. 15.
    W. Glatz, S. Muntwyler, and C. Hierold, Sensors Actuators A Phys. 132, 337 (2006).CrossRefGoogle Scholar
  16. 16.
    M. Strasser, R. Aigner, C. Lauterbach, T.F. Sturm, M. Franosch, and G. Wachutka, Sensors Actuators A 114, 362 (2004).CrossRefGoogle Scholar
  17. 17.
    C.J. Vineis, A. Shakouri, A. Majumdar, and M.G. Kanatzidis, Adv. Mater. 22, 3970 (2010).CrossRefGoogle Scholar
  18. 18.
    O. Bubnova, Z.U. Khan, A. Malti, S. Braun, M. Fahlman, M. Berggren, and X. Crispin, Nat. Mater. 10, 429 (2011).CrossRefGoogle Scholar
  19. 19.
    K.C. See, J.P. Feser, C.E. Chen, A. Majumdar, J.J. Urban, and R.A. Segalman, Nano Lett. 10, 4664 (2010).CrossRefGoogle Scholar
  20. 20.
    B. Zhang, J. Sun, H.E. Katz, F. Fang, and R.L. Opila, ACS Appl. Mater. Interfaces 2, 3170 (2010).CrossRefGoogle Scholar

Copyright information

© TMS 2012

Authors and Affiliations

  • Deepa Madan
    • 1
  • Alic Chen
    • 1
  • Paul K. Wright
    • 1
  • James W. Evans
    • 2
  1. 1.Department of Mechanical EngineeringUniversity of CaliforniaBerkeleyUSA
  2. 2.Department of Materials Science and EngineeringUniversity of CaliforniaBerkeleyUSA

Personalised recommendations