Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation
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The root cause of shock-induced solder joint failures in the range of 800G to 1500G is investigated. Joint stability under various shock and strain level combinations and the impact of isothermal aging on board-level shock performance were analyzed. A test vehicle was developed to obtain various combinations of shock and strain levels in a single board. Using 17 mm × 17 mm body-sized ball grid array packages on a shock test board, isothermal aging was applied prior to shock testing to determine the impact of different interface microstructures. Results revealed clear indications of a correlation between shock and strain and a trend of isothermal-aging-induced degradation. A shift in the failure locations was observed based on the interface intermetallic microstructure, and some preliminary evidence for the influence of Sn grain orientation was identified. The interrelated effects of isothermal aging, locally experienced shock and strain levels, and Sn grain orientation on mechanical shock performance are discussed.
Keywords
Pb-free solder shock impact isothermal aging intermetallics Sn orientation OIMPreview
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