Journal of Electronic Materials

, Volume 38, Issue 12, pp 2470–2478

Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces

Article

DOI: 10.1007/s11664-009-0857-5

Cite this article as:
Guo, H., Guo, J. & Shang, J. Journal of Elec Materi (2009) 38: 2470. doi:10.1007/s11664-009-0857-5

Abstract

The thermal resistance of Si/Sn-52In/Cu sandwiched samples was measured by the laser flash method after various stages of thermal cycling. The thermal resistance was found to increase with increasing thermal cycles after 120 cycles. Cross-sections of the samples were examined by scanning electron microscopy. Cracks were observed in both the solder bulk and the interface between the intermetallic compound and solder. The increase of the thermal resistance was related to widening of the crack segments that were inclined to the interface.

Keywords

Solder thermal interface materials thermal cycling thermal resistance crack propagation 

Copyright information

© TMS 2009

Authors and Affiliations

  1. 1.Shenyang National Laboratory for Materials Science, Institute of Metal ResearchChinese Academy of SciencesShenyangChina
  2. 2.Department of Materials Science and EngineeringUniversity of Illinois at Urbana-ChampaignUrbanaUSA

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