Journal of Electronic Materials

, Volume 38, Issue 1, pp 2–9 | Cite as

Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap

  • I. Ohnuma
  • T. Saegusa
  • Y. Takaku
  • C.P. Wang
  • X.J. Liu
  • R. Kainuma
  • K. Ishida
Open Access
Article

Abstract

The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform second-phase dispersion are shown in relation to the phase diagram, where thermodynamic calculations are a powerful tool for alloy design and the prediction of microstructure. Typical examples of microstructural evolution and properties of Pb-free solders and Ag-based micropowders with high electrical conductivity produced by a gas-atomizing method are presented.

Keywords

Liquid miscibility gap powder phase diagram thermodynamic calculation 

References

  1. 1.
    L. Ratke, S. Diefenbach. Mater. Sci. Eng. R15, 263 (1995).Google Scholar
  2. 2.
    J. Gröbner, R. Schmid-Fetzer. J. Met. 57:19 (2005).Google Scholar
  3. 3.
    C·P. Wang, X.J. Liu, I. Ohnuma, R. Kainuma, K. Ishida (2002) Science 297, 990. doi: 10.1126/science.1073050.PubMedCrossRefADSGoogle Scholar
  4. 4.
    C. Marangoni (1871) Ann. Phys. Chem. 143, 337.CrossRefADSGoogle Scholar
  5. 5.
    J.Z. Zhao, J. He, Z.Q. Hu, and L. Ratke. Z. Metallkd. 95, 362 (2004).Google Scholar
  6. 6.
    M. Wu, A. Ludwig, M. Pelzer, U. Postl. Adv. Eng. Mater. 7, 846 (2005).CrossRefGoogle Scholar
  7. 7.
    J. He, J.Z. Zhao, L. Ratke, Acta Mater. 54, 1749 (2006). doi: 10.1016/j.actamat.2005.12.023.CrossRefGoogle Scholar
  8. 8.
    G. Kapty (2005) J. Mater. Sci. 40, 2175.Google Scholar
  9. 9.
    C·P. Wang, X.J. Liu, Y. Takaku, I. Ohnuma, R. Kainuma, K. Ishida (2004) Metall. Mater. Trans. A 35A, 1243. doi: 10.1007/s11661-004-0298-y.CrossRefGoogle Scholar
  10. 10.
    C·P. Wang, X.J. Liu, R.P. Shi, C. Chen, Y. Wang, I. Ohnuma, R. Kainuma, and K. Ishida, (2007) Appl. Phys. Lett. 91, 141904. doi: 10.1063/1.2794415.CrossRefADSGoogle Scholar
  11. 11.
    X. Liu, D. Qiu, M. Guo, Z. Yang (2005) J. Chin. Polym. Sci. 23, 561.CrossRefGoogle Scholar
  12. 12.
    I. Ohnuma, X.J. Liu, H. Ohtani, K. Ishida (1999) J. Electron. Mater. 28, 1163. doi: 10.1007/s11664-999-0152-5.CrossRefADSGoogle Scholar
  13. 13.
    X.J. Liu, K. Oikawa, I. Ohnuma, R. Kainuma, K. Ishida, J. Met. 55, 53 (2003).MATHGoogle Scholar
  14. 14.
    C.P. Wang, X.J. Liu, M. Jiang, I. Ohnuma, R. Kainuma, K. Ishida (2005) J. Phys. Chem. Solids 66, 246. doi: 10.1016/j.jpcs.2004.08.039.CrossRefADSGoogle Scholar
  15. 15.
    E. Bradley, K. Banerji (1996) IEEE Trans. Components Packag. Manuf. Technol. B19, 320. doi: 10.1109/96.496035.CrossRefGoogle Scholar
  16. 16.
    F. Guo, K·N. Subramanian (2002) Adv. Mater. Proc. 160, 41.Google Scholar
  17. 17.
    R.P. Shi, C.P. Wang, X.J. Liu, C. Shen, and Y. Wang, Abstracts of CALPHAD XXXVII, Saariselkä, Finland, 15–20 June, 2008, p. 32.Google Scholar
  18. 18.
    K. Uenishi, Y. Kohara, S. Sakatani, T. Saeki, K·F. Kobayashi, M. Yamamoto (2002) Mater. Trans. 43, 1833. doi: 10.2320/matertrans.43.1833.CrossRefGoogle Scholar
  19. 19.
    Y. Takaku, I. Ohnuma, R. Kainuma, Y. Yamada, Y. Yagi, Y. Nishibe, and K. Ishida (2006) J. Electron. Mater. 35, 1926. doi: 10.1007/s11664-006-0295-6.CrossRefADSGoogle Scholar
  20. 20.
    Y. Yamada, Y. Takaku, Y. Yagi, Y. Nishibe, I. Ohnuma, Y. Sutou, R. Kainuma, and K. Ishida, (2006) Microelectron. Reliab. 46, 1932. doi: 10.1016/j.microrel.2006.07.083.CrossRefGoogle Scholar
  21. 21.
    Y. Yamada, Y. Takaku, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, I. Ohnuma, and K. Ishida, (2007) Microelectron. Reliab. 47, 2147. doi: 10.1016/j.microrel.2007.07.102.CrossRefGoogle Scholar
  22. 22.
    L.E. Murr, Interfacial Phenomena in Metals and Alloys (Reading, MA: Addison-Wesley, 1975), p. 100.Google Scholar

Copyright information

© TMS 2008

Authors and Affiliations

  • I. Ohnuma
    • 1
  • T. Saegusa
    • 1
  • Y. Takaku
    • 1
  • C.P. Wang
    • 2
  • X.J. Liu
    • 2
  • R. Kainuma
    • 1
  • K. Ishida
    • 1
  1. 1.Department of Materials Science, Graduate School of EngineeringTohoku UniversitySendaiJapan
  2. 2.Department of Materials Science and EngineeringXiamen UniversityXiamenChina

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