Journal of Electronic Materials

, Volume 38, Issue 1, pp 2–9

Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap

  • I. Ohnuma
  • T. Saegusa
  • Y. Takaku
  • C.P. Wang
  • X.J. Liu
  • R. Kainuma
  • K. Ishida
Open Access
Article

Abstract

The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform second-phase dispersion are shown in relation to the phase diagram, where thermodynamic calculations are a powerful tool for alloy design and the prediction of microstructure. Typical examples of microstructural evolution and properties of Pb-free solders and Ag-based micropowders with high electrical conductivity produced by a gas-atomizing method are presented.

Keywords

Liquid miscibility gap powder phase diagram thermodynamic calculation 

Copyright information

© TMS 2008

Authors and Affiliations

  • I. Ohnuma
    • 1
  • T. Saegusa
    • 1
  • Y. Takaku
    • 1
  • C.P. Wang
    • 2
  • X.J. Liu
    • 2
  • R. Kainuma
    • 1
  • K. Ishida
    • 1
  1. 1.Department of Materials Science, Graduate School of EngineeringTohoku UniversitySendaiJapan
  2. 2.Department of Materials Science and EngineeringXiamen UniversityXiamenChina

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