Journal of Electronic Materials

, Volume 36, Issue 12, pp 1732–1734 | Cite as

Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers

  • Shih-Kang Lin
  • Yuhi Yorikado
  • Junxiang Jiang
  • Keun-Soo Kim
  • Katsuaki Suganuma
  • Sinn-Wen Chen
  • Masanobu Tsujimoto
  • Isamu Yanada
Open Access
Article

The development of the microstructure of mechanical-deformation-induced Sn whiskers on electroplated films has been examined using a focused ion beam system (FIB). The 6-μm-thick matte Sn films were compressed by using a ZrO2 ball indenter under ambient conditions. After compression, tin whiskers and small nodules were found adjacent to, and several grains further away from, the indents. The cross-sectional microstructures of the indents and whiskers indicate that the lateral boundaries of the newly created grains caused by recrystallization are the main routes for stress relaxation.

Keywords

Sn whiskers FIB microstructure grain-boundary diffusion 

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Copyright information

© TMS 2007

Authors and Affiliations

  • Shih-Kang Lin
    • 1
    • 2
  • Yuhi Yorikado
    • 2
  • Junxiang Jiang
    • 2
  • Keun-Soo Kim
    • 2
  • Katsuaki Suganuma
    • 2
  • Sinn-Wen Chen
    • 1
  • Masanobu Tsujimoto
    • 3
  • Isamu Yanada
    • 3
  1. 1.Department of Chemical EngineeringNational Tsing Hua UniversityHsin-chuTaiwan
  2. 2.Institute of Scientific and Industrial ResearchOsaka UniversityIbarakiJapan
  3. 3.C. Uyemura & Co., LtdChuo-kuJapan

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