Journal of Electronic Materials

, Volume 33, Issue 12, pp 1550–1556 | Cite as

Interfacial reaction study on a solder joint with Sn-4Ag-0.5Cu solder ball and Sn-7Zn-Al (30 ppm) solder paste in a lead-free wafer level chip scale package

  • Huann-Wu Chiang
  • Jun-Yuan Chen
  • Jeffrey C. B. Lee
  • S. M. Li
Special Issue Paper
Received:
Accepted:

Abstract

The interfacial reactions of solder joints between the Sn-4Ag-0.5Cu solder ball and the Sn-7Zn-Al (30 ppm) presoldered paste were investigated in a wafer level chip scale package (WLCSP). After appropriate surface mount technology (SMT) reflow process on the printed circuit board (PCB) with organic solderability preservative (Cu/OSP) and Cu/Ni/Au surface finish, samples were subjected to 150°C high-temperature storage (HTS), 1,000 h aging. Sequentially, the cross-sectional analysis is scrutinized using a scanning electron microscope (SEM)/energy-dispersive spectrometer (EDS) and energy probe microanalysis (EPMA) to observe the metallurgical evolution in the interface and solder buck itself. It was found that Zn-enriched intermetallic compounds (IMCs) without Sn were formed and migrated from the presolder paste region into the solder after reflow and 150°C HTS test.

Key words

Interfacial reaction lead-free solder intermetallic compound (IMC) Sn-Zn-Al solder paste wafer level chip scale package (WLCSP) 
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Copyright information

© TMS-The Minerals, Metals and Materials Society 2004

Authors and Affiliations

  • Huann-Wu Chiang
    • 1
  • Jun-Yuan Chen
    • 1
  • Jeffrey C. B. Lee
    • 2
  • S. M. Li
    • 2
  1. 1.Department of Materials Science and EngineeringI-SHOU UniversityKaohsiungTaiwan
  2. 2.Engineering CenterAdvanced Semiconductor Engineering, Inc.KaohsiungTaiwan

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