Surface-tension measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additions
Abstract
The maximum bubble-pressure method has been used to measure the surface tension and density of liquid alloys (Ag-Sn)eut + Cu (XCu = 0.005, 0.020, 0.0375, and 0.065 (mole fraction)). The surface tension and density measurements were curried out in the temperature ranges of 262–942°C and 264–937°C, respectively. The linear dependencies of surface tensions and densities on temperature were observed, and they were described by straight-line equations. It has been found that the additions of Cu to the Ag-Sn eutectic alloy increase the surface tension. Experimental data of the surface tension were compared with those from modeling based on Butler’s method, using the optimized-thermodynamic parameters from the literature, and a slight tendency contrary to the experimental results was observed.
Key words
Pb-free soldering materials surface tension density (Ag-Sn)eut + Cu additions Butler’s methodPreview
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