Effect of Different Cooling Media After Solid Solution on the Microstructure and Yield Strength in a Ni-Al Alloy During Aging: Experimental Measurement and Computational Modeling
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In this paper, the effect of different cooling media, i.e., water quenching, air cooling and furnace cooling, after solid solution treatment on the microstructure and yield strength of Ni-15.9Al at. pct alloy during aging at 800 °C was first experimentally investigated. It was found that the morphologies and the particle sizes of γ′ precipitates as well as the yield strength of the target alloys during aging were strongly affected by the cooling media after solid solution. The yield strengths of the target alloys after aging with water quenching and air cooling after solid solution are similar, and higher than that with furnace cooling. By further considering the cost and environment factors, the air cooling after solid solution treatment was thus proposed for industry alloys. Meanwhile, a quantitative simulation of the microstructure evolution in the target alloy during aging was realized by means of phase-field modeling coupling with CALPHAD thermodynamic and atomic mobility descriptions. Moreover, the extracted experimental microstructure of the Ni-15.9Al at. pct alloy with air cooling after solid solution was inputted as the initial microstructure of phase-field simulation. Subsequently, the microstructural features obtained from both phase-field simulations and experiments were imported into the strengthening models to predict the evolution of the total yield strengths during aging. The model-predicted total yield strengths in the Ni-15.9Al at. pct alloy were found to be in the excellent agreement with the experimental results from the tensile tests.
The work was supported by the Youth Talent Project of Innovation-driven Plan at Central South University (Grant No. 2019CX027), and the Hunan Provincial Science and Technology Program of China (Grant No. 2017RS3002)—Huxiang Youth Talent Plan. Ming Wei acknowledges the financial support from the program of China Scholarship Council (No. 201706370128).
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