Metallurgical and Materials Transactions A

, Volume 50, Issue 10, pp 4632–4641 | Cite as

A Review of Eutectic Au-Ge Solder Joints

  • Andreas LarssonEmail author
  • Torleif A. Tollefsen
  • Ole Martin Løvvik
  • Knut E. Aasmundtveit


Gold-germanium (Au-Ge) joints have been part of the electronics industry since the birth of the solid state transistor. Today they find their role as a reliable joining technology, especially for high-temperature applications. This article is a literature study reviewing Au-Ge joints: Their uses, properties, material compatibility, application techniques, and performance characteristics. The review concludes that it is possible to create high-quality and very strong Au-Ge joints with a shear strength up to 150 MPa. They are stable and reliable, showing limited degradation after thousands of hours at high temperature and thousands of thermal cycles. Joints may be used in low-stress applications up to 300 °C.



We want to acknowledge the Norwegian Research Council for supporting this project (Project No.: 244915).


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Copyright information

© The Minerals, Metals & Materials Society and ASM International 2019

Authors and Affiliations

  • Andreas Larsson
    • 1
    • 2
    Email author
  • Torleif A. Tollefsen
    • 3
  • Ole Martin Løvvik
    • 4
  • Knut E. Aasmundtveit
    • 2
  1. 1.Deparment of Applied PhysicsTECHNI ASBorreNorway
  2. 2.Deparment of Materials and Micro-integrationUniversity of South-Eastern Norway (USN)BorreNorway
  3. 3.TEGma ASDrammenNorway
  4. 4.Deparment of Sustainable Energy TechnologySINTEF IndustryOsloNorway

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