Metallurgical and Materials Transactions A

, Volume 50, Issue 1, pp 480–492 | Cite as

Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

  • Zhe Zhang
  • Xiaowu HuEmail author
  • Xiongxin Jiang
  • Yulong LiEmail author


The interfacial microstructures of Sn-3.0Ag-0.5Cu (SAC305) solder systems with thin Ni(P) mono-coatings and Cu-Ni(P) dual-coatings were investigated after reflowing and isothermal aging. The ultrathin mono-Ni(P) plating of the SAC305/Ni(P) solder joint was found to rapidly decompose and then transform into a Ni2SnP phase. An intermetallic compound (IMC) formed at the plating/substrate interface, indicating that the ultrathin mono-Ni(P) plating was not an effective diffusion barrier. However, only a single IMC layer ((Cu,Ni)6Sn5) formed at the solder/plating interface in the SAC305/Cu/Ni(P)/Cu system. The (Cu,Ni)6Sn5 IMC effectively suppressed atomic diffusion, protecting the Ni(P) plating and Cu substrate. Although P-Sn-O pores formed in the root of the (Cu,Ni)6Sn5 IMC layer, the dual-Cu/Ni(P) plating protected the solder system for an extended period. The IMC growth rate constants of the SAC305/Cu, SAC305/Ni(P), and SAC305/Cu/Ni(P)/Cu solder joint systems were 0.180, 0.342, and 0.068 μm/h1/2, respectively. These results indicate that the application of dual-Cu/Ni(P) plating can effectively hinder the growth of IMC.



This study was supported by the Nature Science Foundation of China (No. 51465039, 51765040), and the Nature Science Foundation of Jiangxi Province (20161BAB206122).


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Copyright information

© The Minerals, Metals & Materials Society and ASM International 2018

Authors and Affiliations

  1. 1.Key Lab for Robot & Welding Automation of Jiangxi Province, Mechanical & Electrical Engineering SchoolNanchang UniversityNanchangChina

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