Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires
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The failure mechanism of the electromigration in Ag-Pd bonding wires was investigated through stressing with a current density of 1.23 × 105 A/cm2 at temperatures of 150 °C to 300 °C. It was found that the grains of the wire materials grew rapidly during current stressing for 100 minutes at various temperatures. In contrast, the grain structure remained almost unchanged after storage at these temperatures for 100 minutes without current stressing. The mean-time-to-failure (MTF) for various current-stressed Ag-Pd alloy wires decreased with increases in Pd content. The activation energy for the electromigration of these wire materials was measured, and the results indicated that the main driving force was surface diffusion of Ag.
This study was sponsored by the industrial and academic cooperation programs of Wire Technology Co. LTD. and the National Science Council, Taiwan, under Grant No. NSC-102-2622-E-002-019-CC2 and the Ministry of Science and Technology, Taiwan, under Grant No. MOST-106-2622-E-002-010-CC2.
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