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Metallurgical and Materials Transactions A

, Volume 48, Issue 9, pp 4372–4384 | Cite as

Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder

  • Do-Hyun Jung
  • Ashutosh Sharma
  • Dong-Uk Lim
  • Jong-Hyun Yun
  • Jae-Pil Jung
Article

Abstract

The addition of nanosized AlN particles to Sn-3.0 wt pctAg-0.5 wt pctCu (SAC305) lead-free solder alloy has been investigated. The various weight fractions of AlN (0, 0.03, 0.12, 0.21, 0.60 wt pct) have been dispersed in SAC305 solder matrix by a mechanical mixing and melting route. The influences of AlN nanosized particles on the microstructure, mechanical properties, and solderability (e.g., spreadability and wettability) have been carried out. The structural and morphological features of the nanocomposite solder were characterized by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and transmission electron microscope (TEM). The experimental results show that the best combination of solderability and mechanical properties is obtained at 0.21 wt pct AlN in the solder matrix. The reinforced composite solder with 0.21 wt pct AlN nanoparticles shows ≈25 pct improvement in ultimate tensile strength (UTS), and ≈4 pct increase in the spreadability. In addition, the results of microstructural analyses of composite solders indicate that the nanocomposite solder, especially reinforced with 0.21 wt pct of AlN nanoparticles, exhibits better microstructure and improved elongation percentage, compared with the monolithic SAC305 solder.

Notes

Acknowledgments

This study was supported by the Technology Innovation Program (or Industrial Strategic technology development program, 10051436, Development and mass production of 25 pct reduced prices nano–micro compound Pb-free solder paste for automotive devices in response to ELV Directive), funded by the Ministry of Trade, Industry & Energy (MI, Korea).

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Copyright information

© The Minerals, Metals & Materials Society and ASM International 2017

Authors and Affiliations

  • Do-Hyun Jung
    • 1
  • Ashutosh Sharma
    • 1
  • Dong-Uk Lim
    • 1
  • Jong-Hyun Yun
    • 2
  • Jae-Pil Jung
    • 1
  1. 1.Department of Materials Science and EngineeringUniversity of SeoulSeoulRepublic of Korea
  2. 2.KD One Co. Ltd.SeoulRepublic of Korea

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