, Volume 25, Issue 10, pp 5045–5056 | Cite as

Electrodeposition of Cu2+ in presence of Ni2+ in sulfuric acid system

  • Yu Wang
  • Lei LiEmail author
  • Hongjuan Li
  • Hua Wang
Original Paper


The electrodeposition of Cu2+ in the presence of Ni2+ in a sulfuric acid system was investigated using conventional electrochemical techniques and scanning electron microscopy. The Ni2+ had a hindering effect on the mass transfer of Cu2+, while increasing the temperature and H2SO4 concentration weakened this negative effect. The “S2−” could be hydrolyzated from thiourea and reacted with “Cu2+” and “Ni2+” to form copper sulfide and nickel sulfide, respectively, which obviously increased the charge transfer resistance and refined the particle size of the copper deposit. In addition, the nucleation model of the Cu deposition was changed from instantaneous nucleation and mixed nucleation to progressive nucleation in the presence of thiourea at 4 mg/L.


Cu2+ Ni2+ Diffusion coefficient Electrodeposition Thiourea 



This research is financially supported by the National Science Fund for General Projects (51574135).


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Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  1. 1.State Key Laboratory of Complex Non-ferrous Metal Resources Clean Utilization, Engineering Research Center of Metallurgical Energy Conservation and Emission Reduction of Ministry of Education, Faculty of Metallurgical and Energy EngineeringKunming University of Science and TechnologyKunmingChina
  2. 2.Quality Development InstituteKunming University of Science and TechnologyKunmingChina

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