Aerosol printing and photonic sintering of bioresorbable zinc nanoparticle ink for transient electronics manufacturing

  • Bikram Kishore Mahajan
  • Brandon Ludwig
  • Wan Shou
  • Xiaowei Yu
  • Emmanuel Fregene
  • Hang Xu
  • Heng PanEmail author
  • Xian HuangEmail author
Research Paper


Bioresorbable electronics technology can potentially lead to revolutionary applications in healthcare, consumer electronics, and data security. This technology has been demonstrated by various functional devices. However, majority of these devices are realized by CMOS fabrication approaches involving complex and time-consuming processes that are high in cost and low in yield. Printing electronics technology represents a series of printing and post processing techniques that hold promise to make high performance bioresorbable electronics devices. But investigation of printing approaches for bioresorbable electronics is very limited. Here we demonstrate fabrication of conductive bioresorbable patterns using aerosol printing and photonic sintering approaches. Experimental results and simulation reveals that ink compositions, photonic energy, film thickness, and ventilation conditions may influence the effect of photonic sintering. A maximum conductivity of 22321.3 S/m can be achieved using 1 flash with energy of 25.88 J/cm2 with duration of 2 ms. By combining two cascaded sintering procedures using flash light and laser further improve the conductivity to 34722.2 S/m. The results indicate that aerosol printing and photonic sintering can potentially yield mass fabrication of bioresorbable electronics, leading to prevalence of printable bioresorbable technology in consumer electronics and biomedical devices.


bioresorbable electronics photonic sintering aerosol printing transient electronics printed electronics zinc nanoparticles 



This work was supported financially by Interdisciplinary Intercampus Funding Program (IDIC) of University of Missouri System, University of Missouri Research Board (UMRB), Intelligent System Center (ISC) and Material Research Center (MRC) at Missouri University of Science and Technology. This work was also partially supported by National Science Foundation of USA (Grant No. 1363313) and ORAU Ralph E. Powe Junior Faculty Enhancement Award. Xian HUANG acknowledges the support of the National 1000 Talent Program. This work was supported by National Natural Science Foundation of China (Grant No. 61604108) and Natural Science Foundation of Tianjin (Grant No. 16JCYBJC40600). The authors would like to thank Mr. Brian Porter for help with XPS measurements.

Supplementary material

11432_2018_9366_MOESM1_ESM.pdf (717 kb)
Supplementary material, approximately 717 KB.


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Copyright information

© Science China Press and Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  • Bikram Kishore Mahajan
    • 1
  • Brandon Ludwig
    • 1
  • Wan Shou
    • 1
  • Xiaowei Yu
    • 1
  • Emmanuel Fregene
    • 2
  • Hang Xu
    • 3
  • Heng Pan
    • 1
    Email author
  • Xian Huang
    • 3
    Email author
  1. 1.Department of Mechanical EngineeringMissouri University of Science and TechnologyRollaUSA
  2. 2.Department of Material Science and EngineeringGeorgia Institute of TechnologyAtlantaUSA
  3. 3.Department of Biomedical EngineeringTianjin UniversityTianjinChina

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