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Leaching behaviour and environmental risk assessment of heavy metals from electronic solder in acidified soil

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Abstract

The leaching behaviour of Sn and Pb elements from eutectic SnPb solder of electronic waste in acidic soil was investigated through acidification with HCl–H2SO4 solution and compared with saline solution. The amounts of Sn and Pb elements leached, when subjected to acidic soil, are higher than those with saline soil. Evidence for the significantly preferential release of Sn into the leachate is provided; the galvanic couple accelerated such preferential release. Surface product analysis reveals the slight damage of SnPb in saline soil. Serious dissolution due to electrochemical reaction and a thick, porous PbSO4 surface layer are observed in acidified soil, suggesting more severe toxicity potential of Pb in soil rather than in water.

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References

  1. ASTM (2010) Standard practice for conducting and evaluating laboratory corrosion tests in soils, G162-99, United States, pp. 4

  2. Brennen M, Perumareddi JR, Sastri VS, Elboujdaini M, Brown JR (1998) Studies on leaching of metals from solders due to corrosion. Mater Corros 49:551–555

  3. Cheng CQ, Yang F, Zhao J, Wang LH, Li XG (2011) Leaching of heavy metal elements in solder alloys. Corros Sci 53:1738–1747

  4. He B, Yun Z, Shi J, Jiang G (2013) Research progress of heavy metal pollution in China: sources, analytical methods, status, and toxicity. Chin Sci Bull 58:134–140

  5. Jung J, Lee S, Joo Y, Lee H, Park Y (2008) Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions. Microelectron Eng 85:1597–1602

  6. Li DZ, Conway PP, Liu CQ (2008) Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solution. Corros Sci 50:995–1004

  7. Li Y, Richardson JB, Niu X, Jackson OJ, Laster JD, Walker AK (2009a) Dynamic leaching test of personal computer components. J Hazard Mater 171:1058–1065

  8. Li Y, Richardson JB, Mark Bricka R, Niu X, Yang H, Li L, Jimenez A (2009b) Leaching of heavy metals from E-waste in simulated landfill columns. Waste Manage 29:2147–2150

  9. Man D, Podolak M, Engel G (2006) The influence of tin compounds on the dynamic properties of liposome membranes: a study using the ESR method. Cell Mol Biol Lett 11:56–61

  10. Martin F, Simon M, Garcia I, Romero A, Gonzalez V (2014) Pollution of Pb in soils affected by pyrite tailings: influence of soil properties. In: Hernandez-Soriano MC (Hrsg.), Environmental risk assessment of soil contamination. InTech, pp. 785–798

  11. Mori M, Miura K, Sasaki T, Ohtsuka T (2002) Corrosion of tin alloys in sulfuric and nitric acids. Corros Sci 44:887–898

  12. Nazeri MFM, Mohamad AA (2014) Corrosion measurement of Sn–Zn lead-free solders in 6M KOH solution. Meas 47:820–826

  13. Ongondo FO, Williams ID, Cherrett TJ (2011) How are WEEE doing? A global review of the management of electrical and electronic wastes. Waste Manage 31:714–730

  14. Robinson BH (2009) E-waste: an assessment of global production and environmental impacts. Sci Total Environ 408:183–191

  15. Spalvins E, Dubey B, Townsend T (2008) Impact of electronic waste disposal on lead concentrations in landfill leachate. Environ Sci Technol 42:7452–7458

  16. Subramanian KS, Sastri VS, Elboujdaini M, Connor JW, Davey A (1995) Water contamination: impact of tin-lead solder. Water Res 29:1827–1836

  17. Townsend T, Musson S, Dubey B, Pearson B (2008) Leachability of printed wire boards containing leaded and lead-free solder. J Environ Manage 88:926–931

  18. Townsend TG (2011) Environmental issues and management strategies for waste electronic and electrical equipment. J Air Waste Manage Assoc 61:587–610

  19. Wang LH, Cheng CQ, Yang F, Zhao J (2011) Leaching behavior of lead-free solders in a NaCl-Na2SO4-Na2CO3 mixed solution as simulated soil. J Chin Soc Corros Prot 31(381–384):388 (in Chinese)

  20. Wang MN, Wang JQ, Ke W (2014) Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition. J Mater Sci-Mater Electron 25:1228–1236

  21. Widmer R, Oswald-Krapf H, Sinha-Khetriwal D, Schnellmann M, Böni H (2005) Global perspectives on e-waste. Environ Impact Assess Rev 25:436–458

  22. Xie Y, Giammar DE (2011) Effects of flow and water chemistry on lead release rates from pipe scales. Water Res 45:6525–6534

  23. Yoo YR, Kim YS (2010) Elucidation of the relationship between the electrochemical migration susceptibility of SnPb solders for PCBs and the composition of the resulting dendrites. Met Mater Int 16:613–619

  24. Yuan G, Wang SG, Zhang Y, Huang Y (2010) Corrosion behavior of Q235B steel and L245 steel in Dalian soil saturated with water. Mater Prot 43:61–63, 83 (in Chinese)

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Acknowledgments

The authors wish to acknowledge the financial support of the National Science and Technology Basic Project of the Ministry of Science and Technology of China (No. 2012FY11300), National Natural Science Foundation of China (NNSFC) under the granted (No. 51171037, No. 51134013 and No. 51101024) and the Science Research Fund of Henan Provincial Education Department (No. 14B430009).

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Correspondence to Jie Zhao.

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Responsible editor: Zhihong Xu

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Lao, X., Cheng, C., Min, X. et al. Leaching behaviour and environmental risk assessment of heavy metals from electronic solder in acidified soil. Environ Sci Pollut Res 22, 17683–17690 (2015). https://doi.org/10.1007/s11356-015-4868-x

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Keywords

  • Electronic solder
  • ICP-MS
  • Acidified soil
  • Leaching