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Experimental Mechanics

, Volume 59, Issue 5, pp 725–731 | Cite as

A New Device for Tensile and Compressive Testing at Intermediate Strain Rates

  • A. GilatEmail author
  • J.D. Seidt
  • T.A. Matrka
  • K.A. Gardner
Article
  • 113 Downloads

Abstract

A new device for conducting tensile and compressive tests at strain rates ranging from about 20 s−1 to 250 s−1 is presented. The operation of the device is based on the principles of the Split Hopkinson Bar (SHB) technique, except that the incident bar is replaced by a fast hydraulic actuator and the transmitter bar is very long. One end of the specimen, which is short and has a small cross-sectional area relative to the cross-sectional area of the transmitter bar (like in a SHB test) is attached at one end of the transmitter bar. During a test the actuator applies a force to the specimen. Upon loading the specimen deforms between the actuator and the end of the transmitter bar and a tensile, or compressive, wave starts propagating along the bar. The wave travels to the end of the transmitter bar and reflects back. The force in the specimen is determined from the amplitude of the wave. Digital Image Correlation (DIC) is used to measure the deformation directly on the surface of the specimen. The 40 m long transmitter bar provides 15 ms of time to conduct a test. Stress strain curves from tensile and compression tests with the new device are clean and smooth without any evidence of oscillations or ringing.

Keywords

Intermediate strain rate Tension testing Compression testing 

Notes

Acknowledgements

The research reported in this paper was supported by NASA (NRA Grant NNX08AB50A). Many thanks are due to the project manager, Dr. Mike Pereira of NASA Glen Research Center. Upgrading of the hydraulic actuator was supported by Honda R&D Americas, Inc. The help and advice of Mr. Duane Detwiler is greatly appreciated.

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Copyright information

© Society for Experimental Mechanics 2019

Authors and Affiliations

  1. 1.Department of Mechanical and Aerospace EngineeringThe Ohio State UniversityColumbusUSA

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