Experimental Mechanics

, Volume 47, Issue 5, pp 649–658 | Cite as

Strain Measurements of Silicon Dioxide Microspecimens by Digital Imaging Processing

  • W. N. SharpeJr.
  • J. Pulskamp
  • D. S. Gianola
  • C. Eberl
  • R. G. Polcawich
  • R. J. Thompson
Article

Abstract

Silicon dioxide thin film is a common component in electronic devices and in MEMS, but its mechanical properties have rarely been studied. Techniques have been adapted and developed to conduct tensile tests on 1.0 μm thick silicon dioxide specimens that are 100, 150, and 200 μm wide and either 1 or 2 mm long. One end of the specimen remains fastened to the substrate, and the other is glued to a silicon carbide fiber attached to a 30 g load cell mounted on a piezoelectric translation stage. Strain is measured by digital imaging of two gold lines applied to the gage section of the transparent specimen. Twenty-five tests yield a Young’s modulus of 60.1 ± 3.4 GPa and a fracture strength of 364 ± 57 MPa.

Keywords

Thin films Tensile testing Strain measurement Young’s modulus Silicon dioxide Fracture strength 

References

  1. 1.
    Madou M (1997) Fundamentals of microfabrication. CRC, Boca Raton, FL.Google Scholar
  2. 2.
    May GS, Sze SM (2004) Fundamentals of semiconductor fabrication. Wiley, Hoboken, NJ.Google Scholar
  3. 3.
    Senturia SD (2001) Microsystem design. Kluwer, Norwell, MA.Google Scholar
  4. 4.
    Petersen KE (1982) Silicon as a mechanical material. In: Proceedings of the IEEE, pp 420–457.Google Scholar
  5. 5.
    Sharpe WN Jr. (2001) Mechanical properties of MEMS materials. The MEMS handbook. CRC, Boca Raton, FL, pp 3-1–3-33.Google Scholar
  6. 6.
    Read DT, Dally JW (1992) A new method for measuring the constitutive properties of thin films. J Mater Res 8:1542–1549.Google Scholar
  7. 7.
    Sharpe WN Jr., Yuan B, Edwards RL (1997) A new technique for measuring the mechanical properties of thin films. J Microelectromech Sys 6:193–199.CrossRefGoogle Scholar
  8. 8.
    Tsuchiya T, Tabata O, Sakata J, Taga Y (1997) Specimen size effect on tensile strength of surface micromachined polycrystalline silicon thin films. In: Proceedings IEEE tenth annual international workshop on micro electro mechanical systems, pp 529–534.Google Scholar
  9. 9.
    Sharpe WN Jr., Turner KT, Edwards RL (1999) Tensile testing of polysilicon. Exp Mech 39:162–170.CrossRefGoogle Scholar
  10. 10.
    Sharpe WN Jr., Jackson K, Coles G, Eby MA, Edwards RL (2001) Tensile tests of various thin films. Mechanical properties of structural thin films, ASTM STP 1413, American Society of Testing and Materials, pp 229–247.Google Scholar
  11. 11.
    Chasiotis I, Knauss WG (2000) Microtensile tests with the aid of probe microscopy for the study of MEMS materials. In: Proceedings of the SPIE, pp 96–103.Google Scholar
  12. 12.
    Espinosa HD, Prorok BC, Peng B (2004) Plasticity size effects in free-standing submicron polycrystalline FCC films subjected to pure tension. J Mech Phys Solids 52:667–689.CrossRefGoogle Scholar
  13. 13.
    Haque MA, Saif MTA (2002) In-situ tensile testing of nano-scale specimens in SEM and TEM. Exp Mech 42:123–128.CrossRefGoogle Scholar
  14. 14.
    Long GS, Read DT, McColskey JD, Crago K (2001) Microstructural and mechanical characterization of electrodeposited gold films. ASTM STP 1413, American Society of Testing and Materials, pp 262–277.Google Scholar
  15. 15.
    Jaccodine RJ, Schlegel WA (1966) Measurements of strain at Si–SiO2 interface. J Appl Phys 37:2429–2433.CrossRefGoogle Scholar
  16. 16.
    Petersen KE, Guarnieri CR (1979) Young’s modulus measurements of thin films using micromechanics. J Appl Phys 50:6761–6766.CrossRefGoogle Scholar
  17. 17.
    Weihs TP, Hong S, Bravman JC, Nix WD (1988) Mechanical deflection of cantilever microbeams: a new technique for testing the mechanical properties of thin films. J Mater Res 3:931–942.Google Scholar
  18. 18.
    Carlotti G, Doucet L, Dupeux M (1997) Elastic properties of silicon dioxide films deposited by chemical vapour deposition from tetraethylorthosilicate. Thin Solid Films 296:102–105.CrossRefGoogle Scholar
  19. 19.
    Zhao JH, Ryan T, Ho PS (1999) Measurement of elastic modulus, poisson ratio, and coefficient of thermal expansion of on-wafer submicron films. J Appl Phys 85:6421–6424.CrossRefGoogle Scholar
  20. 20.
    Chen F, Li B, Sullivan TD, Gonzalez CL, Muzzy CD, Lee HK, Levy MD, Dashiell MW, Kolodzey J (2000) Influence of underlying interlevel dielectric films on extrusion formation in aluminum interconnects. J Vac Sci Technol B 18:2826–2834.CrossRefGoogle Scholar
  21. 21.
    Sundararajan S, Bhushan B, Namazu T, Isono Y (2002) Mechanical property measurements of nanocscale structures using an atomic force microscope. Ultramicroscopy 91:111–118.CrossRefGoogle Scholar
  22. 22.
    Tsuchiya T, Inoue A, Sakata J (2000) Tensile testing of insulating thin films: humidity effect on tensile strength of SiO2 films. Sens Actuators, A, Phys 82:286–290.CrossRefGoogle Scholar
  23. 23.
    Gianola DS, Sharpe WN Jr. (2004) Techniques for testing thin films in tension. Exp Tech 28:23–27.CrossRefGoogle Scholar
  24. 24.
    Sharpe WN Jr., Jackson KM, Hemker KJ, Xie Z (2001) Effect of specimen size on Young’s modulus and fracture strength of polysilicon. J Microelectromech Syst 10:317–326.CrossRefGoogle Scholar
  25. 25.
    Weibull W (1951) A statistical distribution of wide applicability. J Appl Mech 18:293–297.MATHGoogle Scholar
  26. 26.
    Bagdahn J, Sharpe WN Jr., Jadaan O (2003) Fracture strength of polysilicon at stress concentrations. J Microelectromech Syst 12:302–312.CrossRefGoogle Scholar
  27. 27.
    Holman JP (1989) Experimental methods for engineers. McGraw-Hill, New York, NY.Google Scholar
  28. 28.
    Spearing SM (2000) Materials issues in microelectromechanical systems (MEMS). Acta Mater 48:179–196.CrossRefGoogle Scholar
  29. 29.
    Dowling NE (2007) Mechanical behavior of materials. Prentice Hall, New Jersey, Table B.4.Google Scholar
  30. 30.
    Sharpe WN Jr., Eby MA, Coles G (2001) Effect of temperature on mechanical properties of polysilicon. In: Proceedings of transducers, pp 1366–1369.Google Scholar

Copyright information

© Society for Experimental Mechanics 2007

Authors and Affiliations

  • W. N. SharpeJr.
    • 1
  • J. Pulskamp
    • 2
  • D. S. Gianola
    • 1
  • C. Eberl
    • 1
  • R. G. Polcawich
    • 2
  • R. J. Thompson
    • 1
  1. 1.Department of Mechanical EngineeringJohns Hopkins UniversityBaltimoreUSA
  2. 2.Sensors and Electron Devices DirectorateUS Army Research LaboratoryAdelphiUSA

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