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Effect of Adding Tungsten Disulfide to a Copper Matrix on the Formation of Tribo-Film and on the Tribological Behavior of Copper/Tungsten Disulfide Composites

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The tribological behavior and formation of tribo-film of copper/tungsten disulfide (WS2) composites featuring 0–30% WS2 volume fractions, prepared using spark plasma sintering were investigated. Results indicated that WS2 as addition into the copper matrix could effectively reduce the coefficient of friction (COF) of Cu/WS2 composites. The lowest COF obtained was 0.16, while the wear rate was approximately 5 × 10−5 mm3·N− 1·m−1 for the Cu/WS2 composite which contained 25vol% of WS2 (here defined as Cu-25WS2). X-ray photoelectron spectroscopy and transmission electron microscopy analyses indicated that an oxygen-rich tribo-film with a thickness of approximately 10 nm was formed on the wear track, while a thick layer which was rich in WS2 and Cu2S and with a thickness of approximately 50 nm was observed below the oxygen-rich tribo-film. The superior tribological properties could ascribed to the formation of these tribo-films.

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This work was supported by the National Nature Science Foundation of China. [Grant Number 51475476]. Thanks to Dr. Yang Li, Dr. Xiaoqin Ou and Dr. Hui Deng from Central South University, China for their kind contributions.

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Correspondence to Pingping Yao or Fenghua Luo.

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Zhao, L., Yao, P., Gong, T. et al. Effect of Adding Tungsten Disulfide to a Copper Matrix on the Formation of Tribo-Film and on the Tribological Behavior of Copper/Tungsten Disulfide Composites. Tribol Lett 67, 98 (2019). https://doi.org/10.1007/s11249-019-1200-9

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  • Copper matrix composites
  • Tribological properties
  • Tungsten disulfide
  • Tribo-film
  • Wear mechanism