Thin fluid film is thought to be formed between the wafer surface and the pad asperity. Hydrodynamic pressure on the surface asperity is periodically generated when particles are passing through it. Fatigue fracture occurs under the effect of periodic pressure, and the fatigue begins from the top to the bottom of the asperity. The removal rate is calculated based on the energy-balance fracture theory. Particle size and its relative velocity are important parameters that affect the polishing effect. Using the multiphase model and the power–law viscosity model of the slurry, particle’s velocity and its distribution in the slurry are numerically calculated. The results indicate that the slurry film thickness needs to be in the same order of the particle size that the particle can generate effective hydrodynamic pressure to remove the asperity materials.
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This work is supported by the Research Fund for the Doctoral Program of Higher Education, No. 20030003026. It is also supported by NSFC Project No. 50475018 and NSFC Project No. 50505020.
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Haosheng, C., Jiang, L., Darong, C. et al. Nano particles’ behavior in non-Newtonian slurry in mechanical process of CMP. Tribol Lett 24, 179–186 (2006). https://doi.org/10.1007/s11249-006-9133-5
- non-Newtonian fluid
- chemical mechanical polishing
- nano particle
- multiphase flow