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Powder Metallurgy and Metal Ceramics

, Volume 58, Issue 5–6, pp 257–264 | Cite as

Study of Silver and Copper Nanoparticles by Electron and Atomic Force Microscopy

  • L. D. Kisterska
  • O. B. LoginovaEmail author
  • S. O. Lysovenko
  • V. M. Tkach
NANOSTRUCTURED MATERIALS
  • 15 Downloads

Electron and atomic force microscopy was used to study nanosuspensions of silver (50 mg/L) and silver (85 mg/L) and copper (25 mg/L) mixtures in edible glycerin and silver and copper nanoparticles directly deposited onto a silicon substrate by ion plasma sputtering in vacuum at cathode voltages of 1000 and 1600 V. A colloidal silver sample (12 mg/L) of the NSP Company (Nature’s Sunshine Products) was studied for comparison. The samples from different batches of silver and silver–copper nanosuspensions consist of independent single-crystalline particles and their aggregates, while the NSP colloidal silver samples mainly consist of individual particles. The characteristic diameter of the particles produced directly in the sputtering process at different cathode voltages was shown to depend on energy transfer: at higher cathode voltages, the nanoparticles become coarser, but no sublattice is observed in the coarsened particles.

Keywords

plasma nanosputtering colloidal solution Ag and Cu nanosuspension particle size distribution 

Notes

Acknowledgments

The authors are grateful to A.V. Kotko, PhD (Phys. & Math.), Frantsevich Institute for Problems of Materials Science, for transmission electron microscopy and to P.M. Litvin, PhD (Phys. & Math.), Lashkaryov Institute of Semiconductor Physics, for scanning electron microscopy.

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  • L. D. Kisterska
    • 1
  • O. B. Loginova
    • 1
    Email author
  • S. O. Lysovenko
    • 1
  • V. M. Tkach
    • 1
  1. 1.Bakul Institute for Superhard Materials, National Academy of Sciences of UkraineKyivUkraine

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