Study of Silver and Copper Nanoparticles by Electron and Atomic Force Microscopy
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Electron and atomic force microscopy was used to study nanosuspensions of silver (50 mg/L) and silver (85 mg/L) and copper (25 mg/L) mixtures in edible glycerin and silver and copper nanoparticles directly deposited onto a silicon substrate by ion plasma sputtering in vacuum at cathode voltages of 1000 and 1600 V. A colloidal silver sample (12 mg/L) of the NSP Company (Nature’s Sunshine Products) was studied for comparison. The samples from different batches of silver and silver–copper nanosuspensions consist of independent single-crystalline particles and their aggregates, while the NSP colloidal silver samples mainly consist of individual particles. The characteristic diameter of the particles produced directly in the sputtering process at different cathode voltages was shown to depend on energy transfer: at higher cathode voltages, the nanoparticles become coarser, but no sublattice is observed in the coarsened particles.
Keywordsplasma nanosputtering colloidal solution Ag and Cu nanosuspension particle size distribution
The authors are grateful to A.V. Kotko, PhD (Phys. & Math.), Frantsevich Institute for Problems of Materials Science, for transmission electron microscopy and to P.M. Litvin, PhD (Phys. & Math.), Lashkaryov Institute of Semiconductor Physics, for scanning electron microscopy.
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