Powder Metallurgy and Metal Ceramics

, Volume 44, Issue 3–4, pp 161–168 | Cite as

Mechanisms for Hardening Film Materials: W - Ti - and TiN - Cu Systems as Examples

  • Leonid R. Shaginyan
  • Alexander V. Kurdyumov
Article
Received:

Abstract

We have studied the mechanism for increasing the hardness of nanocomposite (W, Ti)N film materials (reactive magnetron sputtering of the alloy W - 30 at.% Ti) and TiN - Cu (reactive vacuum arc vaporization of Ti with simultaneous magnetron sputtering of copper). By studying the composition, structure, and microhardness of condensates obtained under different deposition conditions, we have established a correlation between film microhardness and structure. We have shown that the microhardness of a material based on (W, Ti)N is inversely proportional to the grain size. Limitation of the mobility of film-forming species and their access to the growing grains present on the surface by molecules of the nitrides WN and TiN is the mechanism limiting grain growth. A similar mechanism is also operative in formation of a composite coating based on hard (TiN) and soft (Cu) metallic phases. In this case, copper atoms are a grain growth inhibitor. They do not react with the titanium nitride and are sorbed on the nitride grain boundaries, preventing their growth.

Keywords

nanocomposite film material structure film-forming species microhardness 
This is a preview of subscription content, log in to check access.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

REFERENCES

  1. 1.
    V. I. Trefilov, Yu. V. Mil’man, and S. A. Firstov, “The physics of the strength of refractory materials,” in: Physical Materials Science in the USSR [in Russian], Nauk. Dumka, Kiev (1986), pp. 222–251.Google Scholar
  2. 2.
    D. M. Karpinos and L. I. Tuchinskii, “Dispersion-hardened composite materials,” in: Physical Materials Science in the USSR [in Russian], Nauk. Dumka, Kiev (1986), pp. 312–334.Google Scholar
  3. 3.
    S. Veprek, “The search for novel superhard material,” J. Vac. Sci. Technol., A17, No.5, 2401–2420 (1999).Google Scholar
  4. 4.
    J. Musil, “Hard and superhard nanocomposite coatings,” Surf. Coat. Technol., No. 125, 322–330 (2000).Google Scholar
  5. 5.
    A. N. Pilyankevich, V. Y. Kulykovski, and L. R. Shaginyan, “The influence of ion bombardment on the structure of ion-plated indium films,” Thin Solid Films, 137, No.2, 215–224 (1986).CrossRefGoogle Scholar
  6. 6.
    L. R. Shaginyan, M. Misina M., S. Kadlec, et al., “Mechanism of the film composition formation during magnetron sputtering of WTi,” J. Vac. Sci. Technol., A19, No.5, 2554–2566 (2001).Google Scholar
  7. 7.
    V. P. Zakharov and I. M. Protas, “Mass spectrometric study of the conditions for amorphous film formation by condensation from the vapor phase,” Dokl. Akad. Nauk SSSR, 215, No.3, 562–564 (1974).Google Scholar
  8. 8.
    Yu. G. Poltavtsev, N. M. Zakharov, V. M. Pozdnyakova, and I. M. Protas, “Effect of the vapor phase composition on short-range order in the structure of gallium arsenide films,” Kristallografiya, 17, No.1, 203–206 (1972).Google Scholar
  9. 9.
    L. R. Shaginyan, “Pulsed laser deposition of thin films: expectations and reality,” in: Handbook of Thin Film Materials, H. S. Nalwa (ed.), Academic Press, San Diego (2002), Vol. 1, pp. 627–674.Google Scholar
  10. 10.
    A. G. Dirks, R. A. Wolters, and A. J. Nelissen, “On the microstructure property relationship of (W, Ti)N diffusion barriers,” Thin Solid Films, No. 193/194, 201–210 (1990).Google Scholar
  11. 11.
    H. Ramarotafika and G. Lemperiere, “Influence of DC substrate bias on the composition, crystalline size and microstrain of WTi and WTi-N films,” Thin Solid Films, No. 266, 267–273 (1995).Google Scholar
  12. 12.
    J. Musil, “Superhard nanocomposite coatings,” in: Proceedings, 14th International Symposium on Plasma Chemistry (August 1999, Prague), Prague (1999), Vol. 1, p. 17.Google Scholar
  13. 13.
    L. R. Shaginyan, M. Mishina, J. Zemek, et al. “Composition, structure, microhardness and residual stress of W-Ti-N films deposited by reactive magnetron sputtering,” Thin Solid Films, No. 408, 136–147 (2002).Google Scholar
  14. 14.
    S. Myung Hyun, M. Lee Hyuk, G. Han Jeon, and L. R. Shaginyan, “Microstructure and mechanical properties of Cu doped TiN superhard nanocomposite coatings,” Surf. Coat. Technol., No. 163–164, 591–596 (2003).Google Scholar
  15. 15.
    M. Mishina, L. R. Shaginyan, M. Macek, and P. Panjan “Energy resolved ion mass spectroscopy of the plasma during reactive magnetron sputtering,” Surf. Coat. Technol., No. 142–144, 348–354 (2001).Google Scholar
  16. 16.
    J. M. Oparowski, R. D. Sisson, and R. R. Biederman, “Effects of processing parameters on the microstructure and properties of TiW thin film diffusion barriers,” Thin Solid Films, No. 153, 313–328 (1987).Google Scholar
  17. 17.
    P. B. Barna and M. Adamik, “Real structure zone models,” Thin Solid Films, No. 317, 27–31 (1998).Google Scholar
  18. 18.
    M. Ohring, Materials Science of Thin Films, Academic Press, San Diego (1992).Google Scholar
  19. 19.
    D. B. Bergstrom, F. Tian, I. Petrov, et al., “Origin of compositional variations in sputtered Ti-W barriers,” Appl. Phys. Lett., 67, No.21, 3102–3104 (1995).CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, Inc. 2005

Authors and Affiliations

  • Leonid R. Shaginyan
    • 1
  • Alexander V. Kurdyumov
    • 1
  1. 1.Institute for Problems of Materials ScienceNational Academy of Sciences of UkraineKievUkraine

Personalised recommendations