Oxidation of Metals

, Volume 90, Issue 1–2, pp 203–215 | Cite as

Influence of Low Oxygen Content on the Recrystallization Behavior of Rolled Copper Foil

  • Hongliang ZhaoEmail author
  • Wenbo Chen
  • Mingwei Wu
  • Rongping Li
  • Xianglei DongEmail author
Original Paper


In this paper, the influence of low oxygen content on the recrystallization of rolled copper foil was studied at different annealing temperatures. The results showed that the recrystallization temperature decreases with an increase in the oxygen content in the foil. Significant transition points occur when the oxygen content exceeds 30 ppm. The oxygen simultaneously affects particle aggregation on the grain boundaries and the dislocation mobility during deformation processes, modulating the recrystallization. A higher oxygen content enables a lower value of the recrystallization temperature, which can in turn effectively enhance plasticity to improve the forming property of the copper foil. It is expected that our investigations on the recrystallization of copper foil can provide a mechanism-based interpretation and technical support for the production optimization and application of copper-based materials.


Rolled copper foil Oxygen content Recrystallization Microstructure and properties Process optimization 


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© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  1. 1.College of Materials Science and EngineeringZhengzhou UniversityZhengzhouChina
  2. 2.Lingbao Jinyuan Zhaohui Copper Co., LtdLingbaoChina

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