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High-speed and low-power thermally tunable devices with suspended silicon waveguide

  • Fei Duan
  • Kai Chen
  • Yonglin YuEmail author
Article
  • 24 Downloads

Abstract

High-speed and low-power reconfigurable photonic devices, such as thermally tunable devices, are needed for high throughput in optical communication networks. Based on thermo-electric coupling simulation and theoretical analysis, temperature response processes of the thermally tunable devices with suspended silicon waveguide proposed previously are investigated, with a focus on the effects of layer thicknesses and materials. The results show that the response time and the figure of merit (FOM) can both be reduced by 10% and 20% when the heater thickness varies from 0.16 to 0.08 μm and the cladding thickness decreases from 1.2 to 0.8 μm, respectively. The response time of devices with claddings of alumina, aluminum nitride and silicon nitride has an improvement of 50.8%, 59.8% and 83.5% separately compared with that of the device with silica cladding. Through these optimizations, it is demonstrated by the simulation that the response time and power consumption can be reduced to less than 20 μs and 1 mW separately for the thermally tunable switches.

Keywords

Thermally tunable devices Filters Switches Response time Figure of merit 

Notes

Acknowledgements

This work was supported in part by the National Natural Science Foundation of China (No. 61675073), in part by Fundamental Research Funds for the Central Universities (2016YXZD004), in part by the National High Technology Developing Program of China (2013AA014503), and in part by Wuhan International Joint Laboratory on Optoelectronics.

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  1. 1.Wuhan National Laboratory for OptoelectronicsHuazhong University of Science and TechnologyWuhanPeople’s Republic of China

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