Effects of Ag addition on phase transitions, microstructures and solder/copper interfaces of Sn99.1−xCu0.9Agx alloys
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In this work, the effects of Ag addition on phase transitions, microstructure and solder/copper interfaces of Sn99.1−xCu0.9Agx alloys were studied using differential scanning calorimetry, X-ray diffractometry, electron scanning microscopy and energy-dispersive X-ray spectroscopy. The results showed that the addition of Ag to the Sn99.1Cu0.9 alloy changes the thermal behavior of the melting and solidification points of studied alloys. The presence of silver also induced the formation of the Ag3Sn phase and decreased the amount of the Cu6Sn5 compound.
KeywordsAg addition Sn-based alloys Phase transformations
The authors thank FAPESP (Proc. 2012/50570-5), CNPq and CAPES (Finance code 001) for financial support, and César C. S. Silva and Samuel R. P. de Paula for technical support.
- 12.Kraft W, Petzow G, Aldinger F. Beitrag zur Konstitution kupferreicher Dentalamalgame. Z Metallkd. 1980;71:699–703.Google Scholar
- 14.Balzar D, Popa NC. Analyzing microstructure by Rietveld refinement. J Rigaku. 2005;22(1):16.Google Scholar
- 21.Burgess S, Li X, Houand J. High spatial resolution energy dispersive X-ray spectrometry in the SEM and the detection of light elements including lithium. Microsc Anal. 2013;27:S8–13.Google Scholar