Effects of Ag addition on phase transitions, microstructures and solder/copper interfaces of Sn99.1−xCu0.9Agx alloys

  • L. S. SilvaEmail author
  • J. S. Souza
  • R. A. G. Silva


In this work, the effects of Ag addition on phase transitions, microstructure and solder/copper interfaces of Sn99.1−xCu0.9Agx alloys were studied using differential scanning calorimetry, X-ray diffractometry, electron scanning microscopy and energy-dispersive X-ray spectroscopy. The results showed that the addition of Ag to the Sn99.1Cu0.9 alloy changes the thermal behavior of the melting and solidification points of studied alloys. The presence of silver also induced the formation of the Ag3Sn phase and decreased the amount of the Cu6Sn5 compound.


Ag addition Sn-based alloys Phase transformations 



The authors thank FAPESP (Proc. 2012/50570-5), CNPq and CAPES (Finance code 001) for financial support, and César C. S. Silva and Samuel R. P. de Paula for technical support.


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© Akadémiai Kiadó, Budapest, Hungary 2018

Authors and Affiliations

  1. 1.Departamento de Química, Instituto de Ciências Ambientais, Químicas e FarmacêuticasUniversidade Federal de São Paulo-UNIFESPDiademaBrazil

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