Microscopic evaluation of contaminants in ultra-high purity copper
Copper is one of few elements that have no long-lived radioisotopes and which can be electrodeposited to ultra-high levels of purity. Experiments probing neutrino properties and searching for direct evidence of dark matter require ultra-clean copper, containing the smallest possible quantities of radioactive contaminants. Important to the production of such copper is establishing the location and dispersion of contamination within the bulk material. Co-deposition of contaminants during copper electrodeposition and its relationship to nucleation and growth processes were investigated using scanning electron microscopy (SEM), laser ablation inductively coupled plasma mass spectrometry (LA-ICP-MS), and secondary ionization mass spectrometry (SIMS).
KeywordsCopper EBSD Electrodeposition LA-ICP-MS SEM SIMS Thorium Uranium
The authors would like to acknowledge the NNSA Office of Research and Engineering (NA-22) for their support of this work and Chuck Windisch for his technical assistance. Pacific Northwest National Laboratory is managed by Battelle Memorial Institute under contract DE-AC05-76RLO1830.
- 1.Aalseth CE, Brodzinski RL, Farmer OT III, Hoppe EW, Hossbach TW, Miley HS (2005) AIP Conf Proc, p 785Google Scholar
- 3.Aalseth CE, Farmer OT III, Fast JE, Hoppe EW, Hossbach TW, Kephart JD, Litke KE, Liezers M, Miley HS, Mintzer EE, Reeves JH (submitted) Nucl Instrum Methods Phys Res AGoogle Scholar