Journal of Engineering Physics and Thermophysics

, Volume 92, Issue 6, pp 1529–1536 | Cite as

Development of Heat Pipes for Cooling Thermally Stressed Electronics Elements

  • K. I. Delendik
  • N. V. KolyagoEmail author
  • O. G. Penyazkov
  • O. L. Voitik

An algorithm for the development of heat pipes involving the choice of the working fluid, materials for the casing and wick, and the methods of calculating the limits of heat-transmitting ability of heat pipes is suggested. This algorithm has been applied successfully for creating different types of wicks and heat pipes on the basis of which a cooling system has been created for a high-power light-emitting diode lantern.


heat pipe wick thermal resistance light-emitting diode cooling system radiator 


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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  • K. I. Delendik
    • 1
  • N. V. Kolyago
    • 1
    Email author
  • O. G. Penyazkov
    • 1
  • O. L. Voitik
    • 1
  1. 1.A. V. Luikov Heat and Mass Transfer InstituteNational Academy of Sciences of BelarusMinskBelarus

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