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Performance of laser bonded glass/polyimide microjoints in cerebrospinal fluid

  • A. MianEmail author
  • G. Newaz
  • D. G. Georgiev
  • N. Rahman
  • L. Vendra
  • G. Auner
  • R. Witte
  • H. Herfurth
Article

Abstract

In this paper, laser bonded microjoints between glass and polyimide is considered to examine their potential applicability in encapsulating neural implants. To facilitate bonding between polyimide and glass, a thin titanium film with a thickness of 2 μm was deposited on borosilicate glass plates by a physical vapor deposition (PVD) process. Titanium coated glass was then joined with polyimide by using a cw fiber laser emitting at a wavelength of 1.1 μm (1.0 W) to prepare several tensile samples. Some of the samples were exposed to artificial cerebrospinal fluid (aCSF) at 37^∘C for two weeks to assess long-term integrity of the joints. Both the as-received and aCSF soaked samples were subjected to uniaxial tensile loads for bond strengths measurements. The bond strengths for the as-received and aCSF soaked samples were measured to be 7.31 and 5.33 N/mm, respectively. Although the long-term exposure of the microjoints to aCSF has resulted in 26% reduction of bond strength, the samples still retain considerably high strength as compared with the titanium-polyimide samples. The failed glass/polyimide samples were also analyzed using optical microscopy, and failure mechanisms are discussed. In addition, a two dimensional finite element analysis (FEA) was conducted to understand the stress distribution within the substrate materials while the samples are in tension. The FEA results match reasonably well with the experimental load-displacement curves for as-received samples. Detailed discussion on various stress contours is presented in the paper, and the failure mechanisms observed from the experiment are shown in good agreement with the FEA predicted ones.

Keywords

Finite Element Analysis Bond Strength Polyimide Failure Load Physical Vapor Deposition 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science + Business Media, LLC 2007

Authors and Affiliations

  • A. Mian
    • 1
    Email author
  • G. Newaz
    • 3
  • D. G. Georgiev
    • 4
  • N. Rahman
    • 2
  • L. Vendra
    • 2
  • G. Auner
    • 4
  • R. Witte
    • 5
  • H. Herfurth
    • 5
  1. 1.Department of Mechanical and Industrial Eng.Montana State UniversityBozeman
  2. 2.Department of Mechanical EngineeringWayne State University DetroitDetroitUSA
  3. 3.Department of Mechanical Engineering, Center for Smart Sensors and Integrated Microsystems (SSIM); Institute for Manufacturing ResearchWayne State University DetroitDetroitUSA
  4. 4.Center for Smart Sensors and Integrated Microsystems (SSIM)Wayne State University DetroitDetroitUSA
  5. 5.Center for Laser Technology, Fraunhofer USAPlymouthUSA

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