Effect of extreme thermal shocking on the reliability of Sn50Pb49Sb1/Cu solder joint
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The cosmic extreme temperature is deemed to be an enormous problem for the electronic devices and solder joints of on-orbit satellite. In this paper, an extreme thermal shocking test from 77 to 423 K was carried out to partly simulate the space temperature environment. The extreme thermal shocking effect on the microstructure, shear force and fracture behavior of Sn50Pb49Sb1/Cu solder joint was investigated to try to clarify the reliability evolution of solder joint. It was found that after the thermal shocking, Cu6Sn5 layer thickened significantly with the formation of micro-cracks. The columnar shape of Cu6Sn5 layer in as-soldered joint was changed to plane shape due to its excessive growth. The Cu3Sn layer formed and coarsened during the thermal shocking process, but no defects were observed. Owing to the growing interfacial layers and prolonging cracks, the shear force of solder joint was reduced with the increasing shock cycles. The fracture of solder joint was also transformed from solder-controlled mode to a mixed mode of solder and intermetallic compound, giving a different fracture location and lower ductility.
This project was supported by National Natural Science Foundation of China (Grant No. 51675269); Nanjing University of Aeronautics and Astronautics PhD short-term visiting scholar project (Grant No. 190908DF06) and the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD).
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