Journal of Materials Science: Materials in Electronics

, Volume 30, Issue 24, pp 21343–21354 | Cite as

Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

  • Haijiao Zhan
  • Jiayu GuoEmail author
  • Xiazhen Yang
  • Bing Guo
  • Wei Liu
  • Hangyan Shen
  • Xiaorong Wang
  • Weigang Tang
  • Fei Chen


There is a growing demand for silver pastes and inks used in the field of printed electronics. The synthesis of organic surfactant stabilized silver micro-flakes by the solution-phase chemical reduction method at room temperature has attracted wide attention due to its simple equipment, convenient operation and affordable price. However, the electrical conductivity of silver micro-flakes-filled conductive pastes and inks are significantly influenced by residual surfactants. Therefore, the surface modification of silver micro-flakes to remove surface adsorbents becomes a key issue. In this study, the silver frameworks based on the self-sintering silver micro-flakes at room temperature are developed for silver pastes with excellent conductivity. The silver paste with 48 wt% of the sodium nitrate and succinic acid treated silver powders has a resistivity of 1.08 × 10−6 Ω m and excellent adhesion strength after being cured at 140 °C in an oven.



This work is partially supported by the Natural Science Foundation of Zhejiang (LY16F050005) and the Major Research and Development Project of Zhejiang Province (2018C01123).


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Authors and Affiliations

  1. 1.College of Materials Science and EngineeringChina Jiliang UniversityHangzhouPeople’s Republic of China
  2. 2.The Institute of Industrial CatalysisZhejiang University of TechnologyHangzhouPeople’s Republic of China
  3. 3.Hangzhou Huaguang Advanced Welding Materials Co., LTDHangzhouPeople’s Republic of China

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