Effect of Zn incorporation on the electrochemical corrosion properties of SAC105 solder alloys

  • N. K. Liyana
  • M. A. FazalEmail author
  • A. S. M. A. Haseeb
  • Saeed Rubaiee


The corrosion behaviour of lead-free solder alloy, Sn–1.0Ag–0.5Cu–XZn (X = 0, 0.1, 0.5, 1.0) was investigated by polarization, electrochemical impedance spectroscopy, scanning electron microscopy, energy dispersive spectrometry and X-ray diffractometry upon exposure in 3.5 wt% NaCl solution. The polarization curves showed that the addition of Zn in SAC105 solder alloy increased the corrosion current density and shifted the corrosion potential towards more negative values. The corrosion resistance of Sn–1.0Ag–0.5Cu–XZn alloys was reduced with the increase of Zn concentration. The EIS results were in consistent with the findings obtained from polarization curves. The corrosion products detected on the surface includes Sn3O(OH)2Cl2, SnO, SnO2 and ZnO.



Passivation range


Magnitude of impedance


Maximum phase angle


Corrosion potential


Passivation potential


Corrosion current density


Critical current density


Passive current density



The authors would like to acknowledge the financial support under the UMRG Project No.: RP013B-13AET provided by the University of Malaya, Malaysia.


  1. 1.
    T. Xu, X. Hu, Y. Li, X. Jiang, The growth behavior of interfacial intermetallic compound between Sn–3.5 Ag–0.5 Cu solder and Cu substrate under different thermal-aged conditions. J. Mater. Sci.: Mater. Electron. 28(24), 18515–18528 (2017)Google Scholar
  2. 2.
    M. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54, 1741–1768 (2019)CrossRefGoogle Scholar
  3. 3.
    M.N. Bashir, A.S.M.A. Haseeb, A.Z.M.S. Rahman, M.A. Fazal, Effect of cobalt doping on the microstructure and tensile properties of lead free solder joint subjected to electromigration. J. Mater. Sci. Technol. 32, 1129–1136 (2016)CrossRefGoogle Scholar
  4. 4.
    H.R. Kotadia, P.D. Howes, S.H. Mannan, A review: on the development of low melting temperature Pb-free solders. Microelectron Reliab 54, 1253–1273 (2014)CrossRefGoogle Scholar
  5. 5.
    L. Zhang, S.B. Xue, G. Zeng, L. Gao, H. YE, Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging. J. Alloys Compd. 510, 38–45 (2012)CrossRefGoogle Scholar
  6. 6.
    M.N. Bashir, A.S.M.A. Haseeb, A.Z.M.S. Rahman, M.A. Fazal, C.R. Kao, Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping. J. Mater. Sci. 50, 6748–6756 (2015)CrossRefGoogle Scholar
  7. 7.
    A.A. El-Daly. Y. Swilem. M.H. Makled. M.G. El-Shaarawy. A.M. Abdraboh, Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys. J. Alloys Compd. 484, 134–142 (2009)CrossRefGoogle Scholar
  8. 8.
    H.J. Lin, T.H. Chuang, Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn–3Ag–0.5Cu solder joints. J. Alloys Compd. 500, 167–174 (2010)CrossRefGoogle Scholar
  9. 9.
    H.R. Kotadia, O. Mokhtari, M.P. Clode, M.A. Green, S.H. Mannan, Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrate. J. Alloys Compd. 511, 176–188 (2012)CrossRefGoogle Scholar
  10. 10.
    M.A. Dong-Liang, W.U. Ping, Effects of Zn addition on mechanical properties of eutectic Sn–58Bi solder during liquid-state aging. Trans. Nonferrous Met. Soc. China 25, 1225–1233 (2015)CrossRefGoogle Scholar
  11. 11.
    L. Zhang, J.G. Han, C.W. He, Y.H. Guo, Effect of Zn on properties and microstructure of SnAgCu alloy. J. Mater. Sci.: Mater. Electron. 23, 1950–1956 (2012)Google Scholar
  12. 12.
    U.S. Mohanty, K.L. Lin, The effect of alloying element gallium on the polarisation characteristics of Pb-free Sn–Zn–Ag–Al–XGa solders in NaCl solution. Corros. Sci. 48, 662–678 (2006)CrossRefGoogle Scholar
  13. 13.
    N.K. Liyana, M.A. Fazal, Haseeb A S M, A, Polarization and EIS studies to evaluate the effect of aluminum concentration on the corrosion behavior of SAC105 solder alloy. Mater Sci-Poland 35, 694–701 (2017)CrossRefGoogle Scholar
  14. 14.
    B.Y. Wu, Y.C. Chan, M.O. Alam, W. Jillek, Electrochemical corrosion study of Pb-free solders. J. Mater. Res. 21, 62–70 (2006)CrossRefGoogle Scholar
  15. 15.
    E.A. Eid, M.A. Ramadan, A.B. El Basaty, Enhancing the creep resistance of Sn-9.0Zn-0.5Al lead-free solder alloy by small additions of Sb element. Engineering 10, 21–34 (2018)CrossRefGoogle Scholar
  16. 16.
    C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Properties of lead-free solder alloys with rare earth element additions. J Mater Sci Eng. R 44, 1–44 (2004)CrossRefGoogle Scholar
  17. 17.
    D. Li, P.P. Conway, C.Q. Liu, Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solution. Corros. Sci. 50, 995–1004 (2008)CrossRefGoogle Scholar
  18. 18.
    F. Rosalbino, E. Angelini, G. Zanicchi, R. Carlini, R. Marazza, Electrochemical corrosion study of Sn-3Ag-3Cu solder alloy in NaCl solution. Electrochim. Acta 54, 7231–7235 (2009)CrossRefGoogle Scholar
  19. 19.
    E.M.N. Ervina, R. Kamaneeya, Corrosion of lead free solder in KOH electrolyte. Solid State Phenom. 273, 51–55 (2018)CrossRefGoogle Scholar
  20. 20.
    P.C. Pistorius, G.T. Burstein, Aspects of the effects of electrolyte competition on the occurrence of metastable pitting on stainless steel. Corros Sci 36, 525–538 (1994)CrossRefGoogle Scholar
  21. 21.
    F.H. Assaf, S.S.A. El-Rehiem, A.M. Zaky, Pitting corrosion of zinc in neutral halide solutions. Mater Chem Phys 58, 58–63 (1999)CrossRefGoogle Scholar
  22. 22.
    U.S. Mohanty, K.L. Lin, Corrosion behavior of Pb-free Sn-1Ag-0.5Cu-XNi solder alloys in 3.5% NaCl solution. J. Electron. Mater. 42, 628–638 (2013)CrossRefGoogle Scholar
  23. 23.
    M. Bobina, A. Kellenberger, J.P. Millet, C. Muntean, N. Vaszilcsin, Corrosion resistance or carbon steel in weak acid solutions in the presence of L-histidine as corrosion inhibitor. Corros Sci 69, 389–395 (2013)CrossRefGoogle Scholar
  24. 24.
    M. Fayeka, A.S. Haseeb, M.A. Fazal, Electrochemical corrosion behaviour of Pb-free SAC 105 and SAC 305 solder alloys: a comparative study. Sains Malays 46, 295–302 (2017)CrossRefGoogle Scholar
  25. 25.
    M. Fayeka, M.A. Fazal, A.S.M.A. Haseeb, Effect of aluminum addition on the electrochemical corrosion behavior of Sn–3Ag–0.5 Cu solder alloy in 3.5 wt% NaCl solution. J. Mater. Sci.: Mater. Electron. 27, 12193–12200 (2016)Google Scholar

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© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringUniversity of MalayaKuala LumpurMalaysia
  2. 2.Department of Mechanical and Materials EngineeringUniversity of JeddahJeddahKingdom of Saudi Arabia
  3. 3.Department of Industrial EngineeringUniversity of JeddahJeddahKingdom of Saudi Arabia

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