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Preparation and properties of boron nitride/epoxy composites with high thermal conductivity and electrical insulation

  • Ling Weng
  • HeBing Wang
  • Xiaorui Zhang
  • Lizhu Liu
  • Hexin Zhang
Article
  • 78 Downloads

Abstract

A series of boron nitride/epoxy composites with high thermal conductivity have been prepared via addition of different amounts of surface modified h-BN and c-BN powders to epoxy resin matrices. The effects of h-BN and c-BN particles on the surface morphology, thermal properties, dielectric properties and mechanical properties of these composites have been analyzed systematically. These results show that the cross-sectional morphology of these composite materials become increasingly rougher as their BN content increases. The thermal conductivity of h-BN composites were higher than that of c-BN composites, with a 253% increase in thermal conductivity observed for a 20 vol% h-BN composite, whose storage modulus was also increased. The dielectric constants of the c-BN composites were slightly higher than those of h-BN composites, but the overall increases in dielectric constant for both composites were relatively small. The resistivity of the c-BN composites was higher than the c-BN composites, with their flexural strengths decreased by varying amounts, depending on their BN loadings.

Notes

Acknowledgements

This research was supported by the National Natural Science Foundation of China (Nos. 51677045, 51177030), the Harbin Science and Technology Innovation Talents Project (No. 2016RAQXJ059), the Fundamental Research Funds For the Central Universities (HEUCFP201731 and HEUCFP201719).

References

  1. 1.
    J. Hou, G. Li, N. Yang et al., J. RSC Adv. 4, 44282–44290 (2014)CrossRefGoogle Scholar
  2. 2.
    K.C. Yung, H. Liem, J. Appl. Polym. Sci. 106, 3587–3591 (2007)CrossRefGoogle Scholar
  3. 3.
    S.L. Chung, J.S. Lin, J. Mol. 21, 670 (2017)CrossRefGoogle Scholar
  4. 4.
    B.R. Shang, X.L. Zhao, S.R. Zheng, Z.F. Wang, S.H. Qi, J. China Plast. 30, 30–34 (2016)Google Scholar
  5. 5.
    Y.P. Mamunya, V.V. Davydenko, P. Pissis, E.V. Lebedev, J. Eur. Polym. J. 38, 1887–1897 (2002)CrossRefGoogle Scholar
  6. 6.
    C. Chen, D. Hubei Province (Huazhong University of Science and Technology, Wuhan, 2016)Google Scholar
  7. 7.
    Y. Zhang, X. Hu, J.H. Zhao, K. Sheng, W.R. Cannon, J. IEEE Trans. Compon. Packag. Technol. 32, 716–723 (2009)CrossRefGoogle Scholar
  8. 8.
    J. Hong, J. Lee, C. Hong, E. Sang, J. Curr. Appl. Phys. 10, 359–363 (2010)CrossRefGoogle Scholar
  9. 9.
    T. Zhou, X. Wang, X. Liu, D. Xiong, J. Carbon 48, 1171–1176 (2010)CrossRefGoogle Scholar
  10. 10.
    Y. Chen, X. Gao, J. Wang, W. He, V.V. Silberschmidt, J. Appl. Polym. Sci. (2015).  https://doi.org/10.1002/app.41889 Google Scholar
  11. 11.
    A. Rybak, K. Gaska, C. Kapusta, F. Toche, V. Salles, J. Polym. Advan. Technol. 28, 1676–1682 (2017)Google Scholar
  12. 12.
    Y. Wu, F. Li, J.Y. Hu, X. Zhou, Y. Li, J. Appl. Polym. Sci. 19 (2015)Google Scholar
  13. 13.
    J.P. Hong, S.W. Yoon, T.H. Wang, J.S. Oh, S.C. Lee, et al., J. Polym. Eng. Sci. 52, 2435–2442 (2012)CrossRefGoogle Scholar
  14. 14.
    H.E. Ozaytekin, G. Turedi, Ahmetli, J. Polym. Compos. 37, 3423–3432 (2016)CrossRefGoogle Scholar
  15. 15.
    A. Permal, M. Devarajan, H.H. Hung, T. Zahner, D. Lacey, K. Ibrahim, J. Mater. Sci. Mater. Electron. 28, 1–9 (2017)CrossRefGoogle Scholar
  16. 16.
    S. Nie, X. Zhang, J. Luo, Y. Liu, W. Yan, J. Polym. Composite. 38, 1–8 (2017)CrossRefGoogle Scholar
  17. 17.
    J. Fu, L. Shi, D. Zhang, Q. Zhong, Y. Chen, J. Polym. Eng. Sci. 50, 1809–1819 (2010)CrossRefGoogle Scholar
  18. 18.
    J. Wang, H. Li, G. Li, Z. Liu, J. Appl. Polym. Sci. (2017)  https://doi.org/10.1002/app.44855 Google Scholar
  19. 19.
    A.L. Feng, Z.R. Jia, Q. Yu, H.X. Zhang, G.L. Wu, Nano (2018).  https://doi.org/10.1142/S1793292018500376 Google Scholar
  20. 20.
    A.L. Feng, G.L. Wu, C. Pan, Y.Q. Wang, J. Nanosci. Nanotechnol. 17, 3859–3863 (2017)CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  1. 1.College of Material Science and EngineeringHarbin University of Science and TechnologyHarbinPeople’s Republic of China
  2. 2.Key Laboratory of Engineering Dielectric and Its Application, Ministry of EducationHarbin University of Science and TechnologyHarbinPeople’s Republic of China
  3. 3.Suzhou Jufeng Electrical Insulation System Co., LtdSuzhouPeople’s Republic of China
  4. 4.College of Material Science and Chemical EngineeringHarbin Engineering UniversityHarbinPeople’s Republic of China

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