Preparation and properties of boron nitride/epoxy composites with high thermal conductivity and electrical insulation
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A series of boron nitride/epoxy composites with high thermal conductivity have been prepared via addition of different amounts of surface modified h-BN and c-BN powders to epoxy resin matrices. The effects of h-BN and c-BN particles on the surface morphology, thermal properties, dielectric properties and mechanical properties of these composites have been analyzed systematically. These results show that the cross-sectional morphology of these composite materials become increasingly rougher as their BN content increases. The thermal conductivity of h-BN composites were higher than that of c-BN composites, with a 253% increase in thermal conductivity observed for a 20 vol% h-BN composite, whose storage modulus was also increased. The dielectric constants of the c-BN composites were slightly higher than those of h-BN composites, but the overall increases in dielectric constant for both composites were relatively small. The resistivity of the c-BN composites was higher than the c-BN composites, with their flexural strengths decreased by varying amounts, depending on their BN loadings.
This research was supported by the National Natural Science Foundation of China (Nos. 51677045, 51177030), the Harbin Science and Technology Innovation Talents Project (No. 2016RAQXJ059), the Fundamental Research Funds For the Central Universities (HEUCFP201731 and HEUCFP201719).
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