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Effects of Dy substitution for Sn on the solderability and mechanical property of the standard near eutectic Sn–Ag–Cu alloy

  • HuiMing Chen
  • Jinfa Liao
  • Shanjiang Wu
  • Liukui Gong
  • Junfeng Wang
  • Hang Wang
Article
  • 62 Downloads

Abstract

In this study, the solderability of Sn–3.5Ag–0.5Cu–xDy solders were investigated and the shear strength properties of joints with Cu substrate were investigated. The results indicated that a small amount Dy addition can improve the solderability, and the optimal amount of Dy was 0.025 wt%. The maximum shear strength can be found with 0.025 wt% Dy addition, improved by 74%. With the observation of the fracture morphology, it was found that a small amount Dy can improve the ductility of the solder joints; but excessive amount of Dy would deteriorate the shear strength and form large dimples on the fracture surface.

Notes

Acknowledgements

This work was supported by National Natural Science Foundation of China (51561008). Thanks are given to Miss. Jinzhi Liu for her help during sample preparation.

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • HuiMing Chen
    • 1
  • Jinfa Liao
    • 2
  • Shanjiang Wu
    • 2
  • Liukui Gong
    • 2
  • Junfeng Wang
    • 2
  • Hang Wang
    • 1
  1. 1.Institute of Engineering ResearchJiangxi University of Science and TechnologyGanzhouChina
  2. 2.School of Materials Science and EngineeringJiangxi University of Science and TechnologyGanzhouChina

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