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Effect of curing agent and curing substrate on low temperature curable silver conductive adhesive

  • Xiao-Qing WangEmail author
  • Wei-Ping Gan
  • Feng Xiang
  • Bi-Yuan Li
Article
  • 17 Downloads

Abstract

Soldering technology is popularly used as a traditional connecting technology in electronics industry. But this technology often hurts components more or less due to its high temperature processing. Electrical conductive adhesive as a substitute for solder in connecting technology, can reduce harm to components. When preparing curable conductive adhesive, curing agent is necessary for curing process. But conductive adhesives with different types of curing agents have different curing temperatures, curing time and electric conductivity. In this paper, three types of conductive adhesives with different curing agents named dicyandiamide, p-hydroxyphenylacetic acid (HPA), tetraethylenepentamine are being compared. Through resistivity test and differential thermal analysis (DTA), it is found that the conductive adhesive sample using tetraethylenepentamine has the lowest curing temperature and resistivity. Therefore, using tetraethylenepentamine to prepare curable conductive adhesive will be a better choice compared with other two curing agents.

Notes

Acknowledgements

This work is financially supported just by our tutor Wei-ping Gan (the second author).

Funding

This research did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors.

Compliance with ethical standards

Conflict of interest

The authors declare that they have no competing interests.

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© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  1. 1.School of Materials Science and EngineeringCentral South UniversityChangshaChina

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