Advertisement

Study on microstructure and properties of Zn–20Sn–0.2Ni–xRE solders

  • Jun Tian
  • ChunFu Hong
  • XiaoHui Yan
  • LiHua Hong
  • PinQiang DaiEmail author
Article
  • 19 Downloads

Abstract

In the present work, 0.2 wt% Ni and 0.1–0.5 wt% RE (Ce and La mixed rare-earth) were added into Zn–20Sn high-temperature lead-free solders. The effects of Ni and RE additions on the microstructure and properties of the solder alloys were investigated. The results show that with the increase of RE content, the solidus temperature of the solder alloys does not change much, but the liquidus temperature decreases, and the wettability and microhardness of the solder alloys increase. Adding Ni or RE element individually does not change the IMC layer structure at the solder/copper interface, but it affects the growth of the IMC layer. That is, the addition of Ni inhibits the growth of the interface IMC layer, and the addition of RE promotes the growth of the IMC layer.

Notes

Acknowledgements

This work was supported by the scientific and technological project in Fujian Province (2015H0008).

References

  1. 1.
    S. Menon, E. George, M. Osterman, J. Mater. Sci.: Mater. Electron. 26, 4021–4030 (2015)Google Scholar
  2. 2.
    C.W. Liu, K.L. Lin, J. Electron. Mater. 43, 4502–4509 (2014)CrossRefGoogle Scholar
  3. 3.
    S.J. K.Suganuma, K.S. Kim, JOM 61, 64–71 (2009)CrossRefGoogle Scholar
  4. 4.
    J.E. Lee, K.S. Kim, K. Suganuma, Mater. Trans. 46, 2413–2418 (2005)CrossRefGoogle Scholar
  5. 5.
    T. Takahashi, S. Komatsu, H. Nishikawa, J. Electron. Mater. 39, 1241–1247 (2010)CrossRefGoogle Scholar
  6. 6.
    L. Jaeean, K. Keunsoo, K. Suganuma, Mater. Trans. 48, 584–593 (2007)CrossRefGoogle Scholar
  7. 7.
    R. Mahmudi, M. Eslami, J. Mater. Sci.: Mater. Electron. 22, 1168–1172 (2011)Google Scholar
  8. 8.
    R. Mahmudi, M. Eslami, J. Electron. Mater. 39, 2495–2502 (2010)CrossRefGoogle Scholar
  9. 9.
    F. Xing, X. Qiu, J. Mater. Eng. Perform. 24, 1679–1686 (2015)CrossRefGoogle Scholar
  10. 10.
    S.W. Park, S. Nagao, T. Sugahara, K.S. Kim, K. Suganuma, J. Mater. Sci.: Mater. Electron. 24, 4704–4712 (2013)Google Scholar
  11. 11.
    S. Mallick, M.S. Kabir, A. Sharif, J. Mater. Sci.: Mater. Electron. 27, 3608–3618 (2016)Google Scholar
  12. 12.
    G. Zeng, S.D. Mcdonald, Q. Gu, Acta Mater. 83, 357–371 (2015)CrossRefGoogle Scholar
  13. 13.
    W.L. Wang, Y.F. Yan, Mater. Res. Innov. 19, 1102–1106 (2015)Google Scholar
  14. 14.
    J. Tian, China patent ZL2016 1 0415466.7 (14 June 2016)Google Scholar
  15. 15.
    F. Xing, Q. Shang, Y. Lu, J. Liang, X. Qiu, J. Alloys Compd. 666, 122–130 (2016)CrossRefGoogle Scholar
  16. 16.
    C.M.T. Law, C.M.L. Wu, D.Q. Yu, J. Electron. Mater. 35, 89–93 (2006)CrossRefGoogle Scholar
  17. 17.
    J. Tian, P. Dai, X. Li, J. Mater. Sci.: Mater. Electron. 28, 17185–17192 (2017)Google Scholar
  18. 18.
    Y. Du, C. Li, B. Huang, Solder. Surf. Mt. Technol. 27, 7–12 (2015)CrossRefGoogle Scholar
  19. 19.
    X. Li, J. Tian. P. Dai, H. Wang, Rare. Metal Mater. Eng 47, 1860–1865 (2018)CrossRefGoogle Scholar
  20. 20.
    W.L.R. Santos, C. Brito, F. Bertelli, J.E. Spinelli, A. Garcia, J. Alloys Compd. 647, 989–996 (2015)CrossRefGoogle Scholar
  21. 21.
    W.L.R. Santos, C. Brito, J.M.V. Quaresma, J.E. Spinelli, A. Garcia, Mater. Sci. Eng. B 182, 29–36 (2014)CrossRefGoogle Scholar
  22. 22.
    Y. Wang, G. Wang, K. Song, Mater. Des. 119, 219–224 (2017)CrossRefGoogle Scholar
  23. 23.
    S. Kim, K.S. Kim, S.S. Kim, K. Suganuma, J. Electron. Mater. 38, 266–272 (2009)CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • Jun Tian
    • 1
    • 2
    • 3
  • ChunFu Hong
    • 2
    • 3
  • XiaoHui Yan
    • 2
    • 3
  • LiHua Hong
    • 2
    • 3
  • PinQiang Dai
    • 1
    • 2
    • 3
    Email author
  1. 1.School of Materials Science and EngineeringFuzhou UniversityFuzhouChina
  2. 2.School of Materials Science and EngineeringFujian University of TechnologyFuzhouChina
  3. 3.Fujian Provincial Key Laboratory of Advanced Materials Processing and ApplicationFuzhouChina

Personalised recommendations