Fabrication of high-temperature-resistant bondline based on multilayer core–shell hybrid microspheres for power devices
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This paper presents a fabrication method for high-temperature-resistant bondlines based on Cu@Ag@Sn multilayer core–shell hybrid microspheres in which a Ag layer was adopted to accelerate the consumption of a Sn layer. The phase transformation and microstructural evolution during the bonding process were investigated in detail. After the microspheres were heated at 250 °C for 20 min under a pressure of 0.5 MPa, the bondline could withstand high operation temperatures of up to 480 °C. After reflowing at 250 °C for just 5 min, the outer low-melting-point Sn layer was completely consumed. After 20 min, the bondline was composed of Ag3Sn and Cu3Sn intermetallic compounds with a dispersion of Cu microspheres. The average shear strengths of the resulting bondlines were 39.9 and 31.9 MPa at room temperature and at 400 °C, respectively.
This work is financially supported by the Science and Technology Project of Shenzhen (No. JCYJ20160318095308401).
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