Fabrication of high-temperature-resistant bondline based on multilayer core–shell hybrid microspheres for power devices

  • Fuwen Yu
  • Hongtao ChenEmail author
  • Chunjin HangEmail author
  • Mingyu Li


This paper presents a fabrication method for high-temperature-resistant bondlines based on Cu@Ag@Sn multilayer core–shell hybrid microspheres in which a Ag layer was adopted to accelerate the consumption of a Sn layer. The phase transformation and microstructural evolution during the bonding process were investigated in detail. After the microspheres were heated at 250 °C for 20 min under a pressure of 0.5 MPa, the bondline could withstand high operation temperatures of up to 480 °C. After reflowing at 250 °C for just 5 min, the outer low-melting-point Sn layer was completely consumed. After 20 min, the bondline was composed of Ag3Sn and Cu3Sn intermetallic compounds with a dispersion of Cu microspheres. The average shear strengths of the resulting bondlines were 39.9 and 31.9 MPa at room temperature and at 400 °C, respectively.



This work is financially supported by the Science and Technology Project of Shenzhen (No. JCYJ20160318095308401).


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© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  1. 1.Materials Science and Engineering DepartmentHarbin Institute of TechnologyShenzhenChina
  2. 2.State Key Laboratory of Advanced Welding and JoiningHarbin Institute of TechnologyHarbinChina

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