Influence of substrate temperature on the growth and properties of reactively sputtered In-rich InAlN films
- 234 Downloads
- 6 Citations
Abstract
Indium-rich InAlN films were prepared on Si (111) substrates by using reactive co-sputtering in a mixed Ar-N2 atmosphere. The substrate temperature was varied from room temperature to 300 °C to investigate the film’s growth and properties at different temperatures. Structural and optical properties of the films were evaluated through high resolution XRD and Raman spectroscopy respectively, surface morphology and roughness analysis was performed by using FE-SEM and AFM respectively, whereas the electrical characterizations were made through resistivity and current–voltage (I–V) measurements respectively. Highly c-axis oriented nanocrystalline InAlN films with wurtzite structure were obtained at a substrate temperature of 100 °C and above. Structural quality of the films was improved with increase of the substrate temperature. The Raman spectroscopy revealed A1 (LO) modes which became more intense by the increasing the substrate temperature. The electrical studies indicated n-type nature of InAlN film having electron concentration in the range 3 × 1019–20 × 1019 cm−3. The electrical resistivity exhibited a decreasing trend with increase of the deposition temperature. The I–V measurements showed a noticeable increase in the value of current by increasing the substrate temperature to 300 °C.
Keywords
Electrical Resistivity Substrate Temperature Deposition Temperature Phonon Mode Crystalline QualityNotes
Acknowledgments
It is gratefully acknowledged the financial support provided by Universiti Sains Malaysia (USM), Malaysia and The World Academy of Sciences (TWAS), Italy for this work. The technical support of Mr. Jamil for the sputter deposition and Mr. Mushtaqim Abubakar for the XRD is also acknowledged.
References
- 1.K. Wang, R.W. Martin, D. Amabile, P.R. Edwards, S. Hernandez, E. Nogales, K.P. O’Donnell, K. Lorenz, E. Alves, V. Matias, A. Vantomme, D. Wolverson, I.M. Watson, J. Appl. Phys. 103, 073510-1–073510-3 (2008)Google Scholar
- 2.M. Kariya, S. Nitta, S. Yamaguchi, H. Kato, T. Takeuchi, C. Wetzel, H. Amano, I. Akasaki, Jpn. J. Appl. Phys. 37, L 697–L 699 (1998)CrossRefGoogle Scholar
- 3.C. Berger, A. Dadgar, J. Bläsing, A. Lesnik, P. Veit, G. Schmidt, T. Hempel, J. Christen, A. Krost, A. Strittmatter, J. Cryst. Growth 414, 105–109 (2015)CrossRefGoogle Scholar
- 4.A. Watanabe, J.J. Freedsman, R. Oda, T. Ito, T. Egawa, Appl. Phys. Express 7, 041002-1–041002-3 (2014)CrossRefGoogle Scholar
- 5.W.Y. Weng, S.J. Chang, T.J. Hsueh, C.L. Hsu, M.J. Li, W.C. Lai, Sens. Actuators B 140, 139–142 (2009)CrossRefGoogle Scholar
- 6.H.F. Liu, C.C. Tan, G.K. Dalapati, D.Z. Chi, J. Appl. Phys. 112, 063114-1–063114-5 (2012)Google Scholar
- 7.H.F. Liu, S.B. Dolmanan, S. Tripathy, G.K. Dalapati, C.C. Tan, D.Z. Chi, J. Phys. D Appl. Phys. 46, 095106-1–095106-7 (2013)Google Scholar
- 8.O. Ambacher, J. Phys. D Appl. Phys. 31, 2653–2710 (1998)CrossRefGoogle Scholar
- 9.M. Kariya, S. Nitta, S. Yamaguchi, H. Amano, I. Akasaki, Jpn. J. Appl. Phys. 38, L 984–L 986 (1999)CrossRefGoogle Scholar
- 10.S. Yamaguchi, M. Kariya, S. Nitta, H. Kato, T. Takeuchi, C. Wetzel, H. Amano, I. Akasaki, J. Cryst. Growth 195, 309–313 (1998)CrossRefGoogle Scholar
- 11.K.S. Kim, A. Saxler, P. Kung, M. Razeghi, K.Y. Lim, Appl. Phys. Lett. 71, 800–802 (1997)CrossRefGoogle Scholar
- 12.S. Yamaguchi, M. Kariya, S. Nitta, T. Takeuchi, C. Wetzel, H. Amano, I. Akasaki, Appl. Phys. Lett. 76, 876–878 (2000)CrossRefGoogle Scholar
- 13.W. Terashima, S.B. Che, Y. Ishitani, A. Yoshikawa, Jpn. J. Appl. Phys. 45, L539–L542 (2006)CrossRefGoogle Scholar
- 14.H.K. Chauveau, P.D. Mierry, J.M. Chauveau, J.Y. Duboz, J. Cryst. Growth 316, 30–36 (2011)CrossRefGoogle Scholar
- 15.Q. Guo, H. Ogawa, A. Yoshida, J. Cryst. Growth 146, 462–466 (1995)CrossRefGoogle Scholar
- 16.H. Naoi, K. Fujiwara, S. Takado, M. Kurouchi, D. Muto, T. Araki, H. Na, Y. Nanishi, J. Electron. Mater. 36, 1313–1319 (2007)CrossRefGoogle Scholar
- 17.Y.H. Wu, Y.Y. Wong, W.C. Chen, D.S. Tsai, C.Y. Peng, J.S. Tian, L. Chang, E.Y. Chang, Mater. Res. Express 1, 015904-1–015904-9 (2014)CrossRefGoogle Scholar
- 18.W.C. Chen, Y.H. Wu, C.Y. Peng, C.N. Hsiao, L. Chang, Nano Scale Res. Lett. 9, 204-1–204-7 (2014)Google Scholar
- 19.A. Gadanecz, J. Bläsing, A. Dadgar, C. Hums, A. Krost, Appl. Phys. Lett. 90, 221906-1–221906-3 (2007)CrossRefGoogle Scholar
- 20.C. Hums, J. Bläsing, A. Dadgar, A. Diez, T. Hempel, J. Christen, A. Krost, K. Lorenz, E. Alves, Appl. Phys. Lett. 90, 022105-1–022105-3 (2007)CrossRefGoogle Scholar
- 21.Q.X. Guo, Y. Okazaki, Y. Kume, T. Tanaka, M. Nishio, H. Ogawa, J. Cryst. Growth 300, 151–154 (2007)CrossRefGoogle Scholar
- 22.H. He, Y. Cao, R. Fu, W. Guo, Z. Huang, M. Wang, C.H. Huang, H. Wang, Appl. Surf. Sci. 256, 1812–1816 (2010)CrossRefGoogle Scholar
- 23.T.-S. Yeh, J.-M. Wu, W.-H. Lan, Thin Solid Films 517, 3204–3207 (2009)CrossRefGoogle Scholar
- 24.Q. Han, C. Duan, G. Du, W. Shi, L. Ji, J. Electron. Mater. 39, 489–493 (2010)CrossRefGoogle Scholar
- 25.C.J. Dong, M. Xu, Q.Y. Chen, F.S. Liu, H.P. Zhou, Y. Wei, H.X. Ji, J. Alloys Compd. 479, 812–815 (2009)CrossRefGoogle Scholar
- 26.H. He, Y. Cao, R. Fu, H. Wang, J. Huang, C. Huang, M. Wang, Z. Deng, J. Mater. Sci. Mater. Electron. 21, 676–681 (2010)CrossRefGoogle Scholar
- 27.H.F. Liu, C.G. Li, K.K.A. Antwi, S.J. Chua, D.Z. Chi, Mater. Lett. 128, 344–348 (2014)CrossRefGoogle Scholar
- 28.N. Afzal, M. Devarajan, K. Ibrahim, J. Alloys Compd. 652, 407–414 (2015)CrossRefGoogle Scholar
- 29.M. Amirhoseiny, Z. Hassan, S.S. Ng, Microelectron. Int. 30, 63–67 (2013)CrossRefGoogle Scholar
- 30.B. Maleyre, S. Ruffenach, O. Briot, B. Gil, A.V. Lee, Superlattice Microstruct. 36, 517–526 (2004)CrossRefGoogle Scholar
- 31.L. Vegard, Zeitschriftfür Physik 5, 17–26 (1921)CrossRefGoogle Scholar
- 32.M.A. Moram, M.E. Vickers, Rep. Prog. Phys. 72, 036502-1–036502-40 (2009)CrossRefGoogle Scholar
- 33.B.D. Culity, R.S. Stock, Elements of X-ray Diffraction (Prentice-Hall, Englewood Cliff’s, NJ, 2001)Google Scholar
- 34.Y.C. Feng, D.E. Laughlin, D.N. Lembeth, J. Appl. Phys. 76, 7311–7316 (1994)CrossRefGoogle Scholar
- 35.S.H. Abud, Z. Hassan, F.K. Yam, Int. J. Electrochem. 7, 10038–10046 (2012)Google Scholar
- 36.M. Amirhoseiny, S.S. Ng, Z. Hassan, Mater. Sci. Semicond. Proc. 35, 216–221 (2015)CrossRefGoogle Scholar
- 37.T.T. Kang, A. Hashimoto, A. Yamamoto, Phys. Rev. B 79, 033301-1–033301-4 (2009)Google Scholar
- 38.Q. Han, C. Duan, G. Du, W. Shi, J. Mater. Res. 25, 1842–1846 (2010)CrossRefGoogle Scholar
- 39.Q. Guo, T. Tanaka, M. Nishio, H. Ogawa, Jpn. J. Appl. Phys. 47, 612–615 (2008)CrossRefGoogle Scholar
- 40.T.S. Oh, J.O. Kim, H. Jeong, Y.S. Lee, S. Nagarajan, K.Y. Lim, C.H. Hong, E.K. Suh, J. Phys. D Appl. Phys. 41, 095402-1–095402-5 (2008)CrossRefGoogle Scholar
- 41.R.B. Chung, F. Wu, R. Shivaraman, S. Keller, S.P. Denbaars, J.S. Speck, S. Nakamura, J. Cryst. Growth 324, 163–167 (2011)CrossRefGoogle Scholar