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Microstructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of Cu content

  • Wen-dong Yang
  • Chang-hai Wang
  • Valeria Arrighi
  • Chun-yan Liu
  • David Watson
Article

Abstract

An organic copper ink with 9.6 wt% of Cu content derived from a short carbon chain organic copper precursor was successfully applied on a modified PI substrate and easily formed a favorable conductive copper film by self-reduction in the sintering process, which showed excellent conductivity. The effects of sintering temperature and time on the microstructure and conductivity action of the copper films were studied by XRD, EDS and SEM and electrical measurements, respectively. The sheet resistance and resistivity were determined to be as low as 0.11 Ω/□ and 2.2 × 10−5 Ω·cm. The conduction mechanism is discussed in terms of the percolation theory.

Keywords

Sinter Temperature Copper Nanoparticles Copper Particle Flexible Substrate Copper Film 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgments

This work is supported by a visiting scholarship from the Chinese Academy of Sciences of China.

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Copyright information

© Springer Science+Business Media New York 2015

Authors and Affiliations

  1. 1.Institute of Sensors, Signals and Systems, School of Engineering and Physical SciencesHeriot-Watt UniversityEdinburghUK
  2. 2.Institute of Chemical Sciences, School of Engineering and Physical SciencesHeriot-Watt UniversityEdinburghUK
  3. 3.Key Laboratory of Photochemical Conversion and Optoelectronic Materials of Technical Institute of Physics and ChemistryChinese Academy of SciencesBeijingPeople’s Republic of China

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