Corrosion behavior of Sn–3.0Ag–0.5Cu solder under high-temperature and high-humidity condition

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Abstract

The aim of this study is to evaluate the corrosion behavior of Sn–3.0Ag–0.5Cu (SAC305) solder alloy under high-temperature and high-humidity condition. The corrosion of SAC305 alloy was attributed to the oxidation of Sn, which formed SnO2 and SnO, and SnO2 existed on the outer layer of the oxide film. After a period exposure, a stable and dense protective oxide film formed on the specimen surfaces, and the specimen which exposed at 75 °C had the thickset oxide film.

Keywords

SnO2 Solder Joint Solder Alloy SAC305 Solder Relative Humidity Condition 
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Notes

Acknowledgments

The authors acknowledge the financial support of this study from Nature Science Foundation 51025104, and the State Key Lab of Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, Shenyang.

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Copyright information

© Springer Science+Business Media New York 2014

Authors and Affiliations

  1. 1.Department of PhysicsHebei Normal University of Science and TechnologyQinhuangdaoChina
  2. 2.State Key Lab of Corrosion and Protection, Institute of Metal ResearchChinese Academy of SciencesShenyangChina

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