Microstructure and thermo-physical properties of a SiC/pure-Al composite for electronic packaging

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Abstract

A preform comprised of 70 vol% SiC particles was infiltrated with commercially pure aluminium to produce the electronic packaging composite. A dense and uniform microstructure was found in the composite. The incorporation of high volume fraction of SiC particles led to a reduction of coefficient of thermal expansion while maintaining a relatively high thermal conductivity. The correlation between the microstructure features and thermo-physical properties was discussed. The performance of the electronic assemblies using the composite baseplate was evaluated. After 80 thermal shocks (–55 to 150 °C), the thermal resistance kept almost constant, demonstrating the potential application of this composite in the electronic packaging.

Keywords

Thermal Resistance Pure Aluminium Electronic Packaging Electronic Assembly Interfacial Reaction Product 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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Copyright information

© Springer Science+Business Media New York 2013

Authors and Affiliations

  1. 1.School of Materials Science and EngineeringHarbin Institute of TechnologyHarbinChina
  2. 2.State Key Laboratory of Advanced Welding JoiningHarbin Institute of TechnologyHarbinChina

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