Electrical conductivity and viscosity of liquid Sn–Sb–Cu alloys

  • Yu. Plevachuk
  • V. Sklyarchuk
  • A. Yakymovych
  • P. Svec
  • D. Janickovic
  • E. Illekova
Article

Abstract

Tin-antimony-copper alloys are under intense consideration as favourable lead-free solders for consumer electronics and telecommunications. The electrical conductivity and viscosity studies were carried out in a wide temperature range above the liquidus. A melting-solidification region was investigated by Differential Scanning Calorimetry (DSC). The scaling relations have been proposed. A comparison with data available in literature is given.

Notes

Acknowledgments

This work was carried out within the framework of the COST Action MP0602, joint Slovak-Ukrainian project APVV-SK-UA-0043-09, projects APVV-0102-07 and VEGA 2/0157/08 and supported by the National Scholarship Programme of the Slovak Republic (Minerva) and the Fundamental Researches State Fund of Ukraine (projects F28-255, F28-329).

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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  • Yu. Plevachuk
    • 1
  • V. Sklyarchuk
    • 1
  • A. Yakymovych
    • 1
  • P. Svec
    • 2
  • D. Janickovic
    • 2
  • E. Illekova
    • 2
  1. 1.Department of Metal PhysicsIvan Franko National UniversityLvivUkraine
  2. 2.Slovak Academy of SciencesInstitute of PhysicsBratislavaSlovakia

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