In situ nanoparticulate-reinforced lead-free Sn–Ag composite prepared by rapid solidification

Article
First Online:
Received:
Accepted:

Abstract

Rapid solidification technology has been successfully adopted for the preparation of in-situ nanoparticulate-reinforced Sn–Ag composite solder. The applied rapid solidification process promotes nucleation and suppresses the growth of intermetallic compounds (IMCs) of Ag3Sn during the eutectic solidification, yielding fine Ag3Sn nanoparticulates with spherical morphology in the solidified solder structures. Those spherical, homogeneously-distributed nanoparticulates IMCs are benefit to improve the surface area per unit volume and obstruct the dislocation lines passing through the solder. Hence, this in-situ nanoparticulate-reinforced Sn–Ag composite exhibits higher microhardness.

Keywords

Rapid Solidification Eutectic Structure Composite Solder Solder Matrix Rapid Solidification Process 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
This is a preview of subscription content, log in to check access.

Notes

Acknowledgements

The authors are grateful to the National Natural Science Foundation of China (No. 50401003), FANEDD of P R China (No. 200335), and the Natural Science Foundation of Tianjin City (No. 033608811), Fok Ying Tong Education Foundation, and the New Century Excellent Person Supporting Project for grant and financial support.

References

  1. 1.
    M. Abtewa, G. Selvaduray, Mater. Sci. Eng. R 95, 27 (2000)Google Scholar
  2. 2.
    K. Zeng, K.N. Tu, Mater. Sci. Eng. R 55, 238 (2002)Google Scholar
  3. 3.
    C.M.L. Wu, D.Q. Yu, C.M.T. Law, L .Wang, Mater. Sci. Eng. R 44, 1 (2004)CrossRefGoogle Scholar
  4. 4.
    F. Guo, J. Lee, S. Choi, J.P. Lucas, T.R. Bieler, J. Electron. Mater 30, 1073 (2001)CrossRefGoogle Scholar
  5. 5.
    I. Dutta, B.S. Majumdar, D. Pan, W.S. Horton, W. Wright, Z.X. Wang, J. Electron. Mater 33, 258 (2004)CrossRefGoogle Scholar
  6. 6.
    S.Y. Hwang, J.W. Lee, Z.H. Lee, J. Electron. Mater 31, 1304 (2002)CrossRefGoogle Scholar
  7. 7.
    L.A. Jacobson, J. Mckittrick, Mater. Sci. Eng. R 11, 355 (1994)CrossRefGoogle Scholar
  8. 8.
    P.Y. Chevalier, Therm. Acta 45, 136 (1988)Google Scholar
  9. 9.
    M.A. Meyers, K.K. Chawla, in Mechanical Behavior of Materials (Upper Saddle River (NJ): Prentice-Hall, 1998), p. 488Google Scholar
  10. 10.
    A. Rosenberg, W.C. Winegard, Acta metall 2, 342 (1954)CrossRefGoogle Scholar
  11. 11.
    B. Chalmers, in Principles of Solidification (New York, John Wiley & Sons Inc, 1964), p. 70Google Scholar
  12. 12.
    W. Kurz, D.J. Fisher, in Fundamentals of Solidification (Switzerland: Trans Tech Publication Ltd, 1989), p. 29Google Scholar
  13. 13.
    X. Deng, N. Chawla, K.K. Chawla, M. Koopman, Acta. Mater. 52, 4291 (2004)CrossRefGoogle Scholar
  14. 14.
    M. Kerr, N. Chawla, Acta. Mater. 52, 4527 (2004)CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2006

Authors and Affiliations

  1. 1.Engineering Research Center of Shape Memory Materials of Ministry of Education, College of Materials Science EngineeringTianjin UniversityTianjinChina

Personalised recommendations