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Enhancing recovery speed and anti-wear capability of high-temperature shape memory polymer with modified boron nitride nanoparticles

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Abstract

Glass transition temperature (Tg) is important for the application of shape memory polymers (SMPs), and here shape memory polyimide (SMPI) with high Tg of 363 °C is reported. High shape recovery speed can improve reliability performance of SMP, and the introduction of modified boron nitride (M-BN) nanoparticles into SMPI matrix can enhance the recovery speed obviously. The faster recovery speed is mainly caused by the increase in thermal diffusivity, which enhances from 0.147 mm2 s−1 for primitive SMPI to 0.190 mm2 s−1 for the composite with 10% M-BN (SMPI/10% M-BN). Anti-wear capability is important for service life and performance reliability of materials, and wear rate decreases from 7.5 × 10−9 g N−1 r−1 for primitive SMPI to 0.83 × 10−9 g N−1 r−1 for SMPI/10% M-BN. The enhanced anti-wear capability is ascribed to high hardness, self-lubricating property and thermal conductivity of BN. Wear mechanism is studied, and it evolves from adhesive and fatigue wear for primitive SMPI to slight adhesive wear for SMPI/10% M-BN.

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Acknowledgements

This work is financially supported by Natural Science Foundation of Heilongjiang Province (LC2018023) and Science and Technology Innovation Program for Talents of Harbin (2017RALXJ004).

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Correspondence to Xinli Xiao.

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Supplementary material 1 (DOCX 656 kb)

Video S1

Shape recovery of primitive SMPI (MPG 15616 kb)

Video S2

Shape recovery of SMPI-10% M-BN (MPG 8826 kb)

Video S3

Shape recovery when heated uniformly (MP4 2871 kb)

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Ao, X., Kong, D., Zhang, Z. et al. Enhancing recovery speed and anti-wear capability of high-temperature shape memory polymer with modified boron nitride nanoparticles. J Mater Sci 55, 4292–4302 (2020) doi:10.1007/s10853-019-04319-5

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