Journal of Materials Science

, Volume 54, Issue 8, pp 6719–6727 | Cite as

High-performance polyamide-imide films and electrospun aligned nanofibers from an amide-containing diamine

  • Gaigai Duan
  • Shuwu Liu
  • Shaohua JiangEmail author
  • Haoqing HouEmail author


Polyamide-imides (PAIs) are highly desired in many applications because of their superior thermal and mechanical properties. In this work, PAI was prepared from an amide-containing diamine and dianhydride by polycondensation and thermal treatment. Both PAI films and aligned electrospun nanofibers (ANFs) were fabricated. FT-IR was used to determine the structure formation of PAI at different annealing temperatures. DSC and TGA were used to evaluate the thermal properties of PAI, while tensile test was applied to evaluate the mechanical properties of PAI films and ANFs. The results indicated that the PAI possessed both outstanding thermal stability and mechanical properties, which provide opportunities for applications in gas separation, high temperature filtration, reinforcement, etc.



Natural Science Foundation of Jiangsu Province of China (BK20180770); National Natural Science Foundation of China (51803093, 21574060 and 21374044); Major Special Projects of Jiangxi Provincial Department of Science and Technology (20114ABF05100); Technology Plan Landing Project of Jiangxi Provincial Department of Education (GCJ2011-24).

Compliance with ethical standards

Conflict of interest

The authors declare that they have no conflict.


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© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  1. 1.College of Materials Science and EngineeringNanjing Forestry UniversityNanjingChina
  2. 2.College of Chemistry and Chemical EngineeringJiangxi Normal UniversityNanchangChina

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