High-performance copper reinforced with dispersed nanoparticles
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Copper (Cu) has high electrical conductivity and is widely used for many industrial applications. However, pure Cu is very soft and improving the mechanical properties of Cu comes at the great expense of electrical and thermal conductivity. In this work, high-performance Cu with superior mechanical properties and reasonable electrical/thermal conductivity was fabricated using a scalable two-step method. First, Cu micro-powders with uniformly dispersed tungsten carbide (WC) nanoparticles were created by a molten salt-assisted self-incorporation process. A bulk nanocomposite was then obtained by melting the powders under pressure. The as-solidified Cu with 40 vol% uniformly dispersed WC nanoparticles exhibits high hardness, a yield strength over 1000 MPa, a Young’s modulus of over 250 GPa, and reasonable electrical and thermal conductivity.
This research did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors. We thank C. Linsley at University of California, Los Angeles for proofreading the manuscript.
Compliance with ethical standards
Conflict of interest
All authors declare that they have no conflict of interest.
- 5.Copper Facts. https://www.copper.org/education/c-facts/. Accessed 6 Mar 2018
- 6.Ma J, Huang F, Huang L, Geng Z, Ning H, Han Z (2002) Trends and development of copper alloys for lead frame. J Funct Mater 33:1–4Google Scholar
- 16.Pierson HO (1996) Handbook of refractory carbides and nitrides: properties, characteristics, processing and apps. William Andrew, NorwichGoogle Scholar
- 17.Eustathopoulos N, Nicholas MG, Drevet B (1999) Wettability at high temperatures. Elsevier, AmsterdamGoogle Scholar
- 20.Stobrawa JP, Rdzawski ZM (2009) Characterisation of nanostructured copper–WC materials. J Achiev Mater Manuf Eng 32:171–178Google Scholar
- 29.Davis JR (2001) Copper and copper alloys. ASM International, New YorkGoogle Scholar
- 32.Israelachvili JN (2011) Intermolecular and surface forces. Academic Press, BurlingtonGoogle Scholar
- 36.Zhou D, Geng H, Zeng W, Sha G, Kong C, Quadir Z, Munroe P, Torrens R, Trimby P, Zhang D (2018) Effect of extrusion temperature on microstructure and properties of an ultrafine-grained Cu matrix nanocomposite fabricated by powder compact extrusion. J Mater Sci 53:5389–5401. https://doi.org/10.1007/s10853-017-1952-2 CrossRefGoogle Scholar
- 37.Girish BM, Basawaraj BR, Satish BM, Somashekar DR (2012) Electrical resistivity and mechanical properties of tungsten carbide reinforced copper alloy composites. Int J Compos Mater 2:37–42Google Scholar
- 39.Stobrawa J, Rdzawski Z (2007) Dispersion–strengthened nanocrystalline copper. J Achiev Mater Manuf Eng 24:35–42Google Scholar
- 40.Zauter R, Kudashov DV (2006) Precipitation hardened high copper alloys for connector pins made of wire. In: Proceedings of ICEC2006/Sendai, pp 257–261Google Scholar
- 41.CuMg0.5. http://www.conductivity-app.org/alloy-sheet/11. Accessed 6 May 2018
- 42.Zhao N, Li J, Yang X (2004) Influence of the P/M process on the microstructure and properties of WC reinforced copper matrix composite. J Mater Sci 39:4829–4834. https://doi.org/10.1023/B:JMSC.0000035321.65140.14 CrossRefGoogle Scholar
- 43.Tsakiris V, Enescu E, Radulian A, Lucaci M, Lungu M, Mocioi N, Leonat L, Cirstea D, Caramitu A (2016) WC–Cu electrical contacts developed by spark plasma sintering process. In: 2016 international symposium on fundamentals of electrical engineering (ISFEE)Google Scholar