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A comparative study on 3D printed silicone-epoxy/acrylate hybrid polymers via pure photopolymerization and dual-curing mechanisms

  • Tingting Zhao
  • Ran Yu
  • Xinpan Li
  • Ying Zhang
  • Xin Yang
  • Xiaojuan Zhao
  • Wei Huang
Polymers
  • 11 Downloads

Abstract

A type of silicone-epoxy resin has been synthesized and compounded with acrylates to obtain hybrid inks for stereolithography 3D printing. Two approaches of printing have been developed: one approach is pure photopolymerization through the addition of free radical and cationic photoinitiators to the hybrid resin; the other approach untilizes a photo-thermal dual-curing system with free radical photoinitiator for acrylates and thermal curing agent for epoxy resin. The results of hardness, gel content, FTIR and SEM measurements show that both systems get highly crosslinked and interpenetrating polymer network structures, but with different extent of phase separation due to different curing processes. Thermalmechanical and mechanical tests demonstrate that 3D objects from the dual-curing system have higher glass transition temperatures, higher printing efficiency and much enhanced mechanical properties compared with these from the pure photopolymerization system. In addition, both of the systems get 3D objects with high printing accuracy and good thermal stability. The dual-curing mechanism, therefore, has distinct advantages over the pure photopolymerization method.

Notes

Acknowledgements

This study is financially supported by the National Natural Science Foundation of China (Nos. 51603208 and 51573189) and the National Key Research and Development Program of China (No. 2017YFB0404800).

Compliance with ethical standards

Conflict of interest

The authors declare no competing financial interest.

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  1. 1.Institute of ChemistryChinese Academy of SciencesBeijingPeople’s Republic of China
  2. 2.University of Chinese Academy of SciencesBeijingPeople’s Republic of China

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